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US 12,765,354 B1Granted
High frequency interconnect with reduced mutual interference
AssigneeAwave Semiconductor India Pvt. Ltd.
InventorsIlamparidhi Ilangovan, Musappagari Gangaraju, Diksha Acharya
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Abstract
An interconnect that includes different types of cross talk reduction elements that includes metal cages and conductive cage coupling elements that electrically couple the metal cages and are configured to reduce cross talk between high frequency signals.
Claims19
An interconnect, comprising:
- an interconnect portion that comprises:
- first signal conductors that are formed in a first metal layer and are configured to convey first signals;
- second signal conductors that are formed in a second metal layer and are configured to convey second signals;
- third signal conductors that are formed in a third metal layer and are configured to convey third signals;
- wherein the first signals, the second signals and the third signals are high-frequency signals having a frequency that is at least one Gigahertz;
- metal cages that surround the second signal conductors and are configured to reduce cross talk related to the second signals;
- wherein each metal cage comprises (i) a proximal conductive grid that is formed in the first metal layer, (ii) a distal conductive grid that is formed in the third metal layer;
- and (iii) a set of inter-layer vias that connect the proximal conductive grid to the distal conductive grid;
- and
- conductive cage coupling elements that electrically couple the metal cages and are configured to reduce cross talk between the first signals and the third signals.
7 more elements
A method for operating an interconnect having an interconnect portion, the method comprises:
- conveying second signals, by first signal conductors that are formed in a first metal layer of the interconnect portion;
- conveying second signals, by second signal conductors that are formed in a second metal layer of the interconnect portion;
- conveying third signals, by third signal conductors that are formed in a third metal layer of the interconnect portion;
- wherein the first signals, the second signals and the third signals are high-frequency signals having a frequency that is at least one Gigahertz;
- reducing cross talk related to the second signals, by metal cages of the interconnect portion, the metal cages surround the second signal conductors;
- wherein each metal cage comprises (i) a proximal conductive grid that is formed in the first metal layer, (ii) a distal conductive grid that is formed in the third metal layer;
- and (iii) a set of inter-layer vias that connect the proximal conductive grid to the distal conductive grid;
- and
- reducing cross talk between the first signals and the third signals by conductive cage coupling elements of the interconnect portion, the conductive cage coupling elements electrically couple the metal cages.
6 more elements
Dependencies are inferred from the claim text.