Processing apparatus and processing method
AssigneeTokyo Electron Limited
InventorKazuya Ikeue
Life of this patent
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AssigneeTokyo Electron Limited
InventorKazuya Ikeue
Estimating the term…
A processing apparatus configured to process a substrate includes a substrate holder having a substrate holding surface configured to attract and hold the substrate thereon, and including a porous member serving as a substrate attracting member and a chuck base configured to support the porous member; a liquid supply line connected to the substrate holder and configured to supply water to the porous member; an entire surface cleaner configured to clean an entire surface of the substrate holder; an edge cleaner configured to clean an edge portion of the substrate holding surface; and a controller. The controller is configured to cause the processing apparatus to carry out the substrate that has been ground by a grinder from the substrate holder and control the entire surface cleaner and the edge cleaner to simultaneously clean both the entire surface of the substrate holder and the edge portion of the substrate holding surface.
A processing apparatus configured to process a substrate, the processing apparatus comprising:
Dependencies are inferred from the claim text.