US 12,765,313 B2 · Methods and apparatus for chucking a bowed substrate

Abstract

Methods and substrate processing systems of chucking a bowed substrate are provided herein. In some embodiments, a substrate processing system includes: a pedestal to support a substrate, the pedestal having a plurality of chucking regions; a warpage detection system having one or more sensors to detect warpage of the substrate; and a plurality of adjustable chucking components disposed in the pedestal corresponding with the plurality of chucking regions, wherein the plurality of adjustable chucking components are configured to facilitate applying different amounts of force, heating, or cooling to the substrate based on the warpage of the substrate.

Claims20

Dependent claims

A substrate processing system, comprising:

a pedestal to support a substrate, the pedestal having a plurality of chucking regions, wherein the plurality of chucking regions comprise a central chucking region and a plurality of peripheral chucking regions disposed about the central chucking region and having a different shape than the central chucking region;
a warpage detection system having one or more sensors to detect warpage of the substrate;
and
a plurality of adjustable chucking components disposed in the pedestal corresponding with the plurality of chucking regions, wherein the plurality of adjustable chucking components are configured to facilitate applying different amounts of force, heating, or cooling to the substrate based on the warpage of the substrate.

1 more element

A method of chucking a bowed substrate, comprising:

placing the bowed substrate on a substrate support having a plurality of chucking regions, wherein the plurality of chucking regions are pie shaped;
detecting, with a warpage detection system having one or more sensors, one or more contact regions of the plurality of chucking regions where the bowed substrate is touching the substrate support and one or more non-contact regions of the plurality of chucking regions where the bowed substrate is not touching the substrate support;
and
applying a different amount of force, heating, or cooling to the bowed substrate via the substrate support at locations corresponding to the one or more non-contact regions than force, heating, or cooling applied to the one or more contact regions to flatten the bowed substrate, and wherein applying the force, heating, or cooling comprises at least one of:
vacuum chucking the bowed substrate;
electrostatically chucking the bowed substrate via a plurality of electrodes disposed in the substrate support;
heating or cooling the bowed substrate via a heater or cooling channels disposed in the substrate support;
magnetically attracting the bowed substrate via magnets disposed in the substrate support;
or
applying a physical force on the bowed substrate via a plurality of pushers.

7 more elements

Dependencies are inferred from the claim text.

Methods and apparatus for chucking a bowed substrate

Life of this patent

Methods and apparatus for chucking a bowed substrate

Life of this patent

Abstract

Claims20