Substrate treating apparatus and substrate treating method

A substrate treating apparatus comprising:

• a process chamber having a processing space in which a substrate is plasma-treated;
• a gas supply unit disposed in the process chamber, supplying a treatment gas to the process chamber, and functioning as a first plasma generating electrode within the processing space;
• a gas discharge unit formed on one side of the process chamber or the gas supply unit;
• a substrate support unit disposed in the process chamber to support the substrate and functioning as a second plasma generating electrode within the processing space;
• and
• a laser irradiation unit irradiating the substrate with a plurality of lasers having different pulse widths to heat the substrate to reach a temperature at which the substrate is plasma-treated, wherein
• the laser irradiation unit is disposed above the process chamber and irradiates an upper surface of the substrate with the plurality of lasers,
• the upper portion of the process chamber is formed of a transparent window so that the plurality of lasers irradiated from the laser irradiation unit pass through the transparent window, and
• the gas supply unit is disposed between the transparent window and the substrate, and the gas supply unit is formed of a transparent material so that the plurality of lasers passing through the transparent window pass through the gas supply unit.

A substrate treating method comprising:

• a substrate heating operation of irradiating a substrate with a plurality of lasers having different pulse widths to heat the substrate to reach a temperature at which the substrate is plasma-treated;
• and
• a substrate treating operation of plasma-treating the substrate, wherein
• the substrate is disposed in a process chamber having a processing space in which the substrate is plasma-treated,
• the plurality of lasers are generated by a laser irradiation unit that is disposed above the process chamber and that irradiates an upper surface of the substrate with the plurality of lasers,
• the upper portion of the process chamber is formed of a transparent window so that the plurality of lasers irradiated from the laser irradiation unit pass through the transparent window, and
• a gas supply unit that supplies a treatment gas into the process chamber is disposed between the transparent window and the substrate, and the gas supply unit is formed of a transparent material so that the plurality of lasers passing through the transparent window pass through the gas supply unit.