# US 12,765,303 B2 · Apparatus and method for wafer cleaning > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,765,303 B2 - Document ID: US12765303B2 - Status: Granted - Kind: B2 - Application number: 19/031,474 - Filed: 2025-01-18 - Published: 2025-05-22 - Granted: 2026-10-13 - Earliest claimed: 2018-08-15 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Bo Chen Chen; Sheng-Wei Wu; Yung-Li Tsai - Web page: https://patentgrep.com/patent/US12765303B2 ## CPC - H10P 72/0412: {using mainly scrubbing means, e.g. brushes} - A46B 13/023: {with means for inducing vibration to the bristles} - B08B 1/12: Brushes - B08B 1/20: Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor - B08B 1/36: rotating about an axis orthogonal to the surface - B08B 3/041: {Cleaning travelling work} - B08B 7/04: by a combination of operations - H10P 70/20: {Cleaning during device manufacture} - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - B08B 1/32: using rotary cleaning members - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - A46B: BRUSHES (handles not integral with brushware B25G) - B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL ## Abstract The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration. ## Claims ### Claim 1 An apparatus, comprising: a wafer holder configured to: hold a wafer in a first orientation during a first mode of operation, and hold the wafer in a second orientation during a second mode of operation; a nozzle configured to dispense a fluid on a first surface of the wafer; and a brush configured to: vibrate along a first direction during the first mode of operation, vibrate along a second direction during the second mode of operation, and clean a second surface of the wafer, wherein the brush comprises: bristles of different lengths and diameters; and an outlet configured to dispense the fluid on the second surface of the wafer. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the first and second orientations are perpendicular to each other. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the first and second directions are perpendicular to each other. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the brush further comprises an ultrasonic emitter configured to ultrasonically vibrate the bristles of the brush. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the brush further comprises a pressure sensor configured to detect a pressure applied to the brush against the wafer. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein the brush further comprises a location sensor configured to track a location of the brush on the second surface of the wafer in real-time. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the brush further comprises: an ultrasonic emitter disposed under the bristles; a pressure sensor disposed under and in contact with the ultrasonic emitter; and a location sensor disposed under and in contact with the pressure sensor. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein the outlet comprises a conductive layer of carbon nanostructures. ### Claim 9 (depends on 1) The apparatus of claim 1, further comprising a connecting nozzle arm configured to rotate the nozzle. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein the nozzle is configured to: dispense the fluid in the first direction during the first mode of operation; and dispense the fluid in the second direction during the second mode of operation. ### Claim 11 An apparatus, comprising: a wafer holder configured to: hold a wafer in a horizontal orientation during a first mode of operation, and hold the wafer in a vertical orientation during a second mode of operation; a nozzle configured to dispense a fluid on a first surface of the wafer; and a brush configured to: vibrate along a vertical direction during the first mode of operation, vibrate along a horizontal direction during the second mode of operation, and clean a second surface of the wafer, wherein the brush comprises: bristles of different lengths and diameters disposed on a base structure, a pressure sensor configured to detect a pressure applied to the brush against the wafer, and a spray outlet configured to dispense the fluid onto the second surface of the wafer. ### Claim 12 (depends on 11) The apparatus of claim 11, wherein the brush further comprises an image sensor configured to monitor a change in color of the bristles. ### Claim 13 (depends on 11) The apparatus of claim 11, wherein the brush further comprises a location sensor configured to track a location of the brush on the second surface of the wafer in real-time. ### Claim 14 (depends on 11) The apparatus of claim 11, wherein the spray outlet is embedded in the base structure. ### Claim 15 An apparatus, comprising: a wafer holder configured to: hold a wafer in a horizontal orientation during a first mode of operation, and hold the wafer in a vertical orientation during a second mode of operation; a nozzle configured to dispense a fluid on a first surface of the wafer; and a brush comprising bristles of different lengths and diameters disposed on a base structure and configured to: vibrate along a vertical direction during the first mode of operation, vibrate along a horizontal direction during the second mode of operation, and clean a second surface of the wafer. ### Claim 16 (depends on 15) The apparatus of claim 15, further comprising a connecting nozzle arm configured to rotate the nozzle. ### Claim 17 (depends on 15) The apparatus of claim 15, wherein the nozzle is configured to: dispense the fluid in a first direction during the first mode of operation, and dispense the fluid in a second direction during the second mode of operation. ### Claim 18 (depends on 15) The apparatus of claim 15, wherein the brush further comprises a location sensor configured to track a location of the brush on the second surface of the wafer in real-time. ### Claim 19 (depends on 15) The apparatus of claim 15, wherein the wafer holder is further configured to rotate and heat the wafer concurrently. ### Claim 20 (depends on 15) The apparatus of claim 15, wherein the brush further comprises an ultrasonic emitter configured to ultrasonically vibrate the bristles of the brush.