Semiconductor processing using a two-dimensional polymer
AssigneeTokyo Electron Limited
InventorsKandabara Tapily, Robert D. Clark, Gerrit Leusink, Charlotte Cutler, Jeffrey Smith
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Abstract
In certain embodiments, a method of microfabrication includes depositing a 2D polymer material over a substrate surface having a first material and a second material such that the 2D polymer adheres to the first material without adhering to the second material. The method further includes depositing a target material over the second material. The 2D material adhered to the first material inhibits deposition of the target material over the first material. The method further includes removing the 2D polymer material.
Claims15
A method of microfabrication, the method comprising:
- depositing a two-dimensional (2D) polymer material over a substrate surface having a first material and a second material such that the 2D polymer material adheres to the first material without adhering to the second material;
- depositing a target material over the second material, the 2D polymer material adhered to the first material inhibiting deposition of the target material over the first material;
- and
- removing the 2D polymer material.
A method of microfabrication, the method comprising:
- receiving a semiconductor workpiece that comprises first regions and the second regions formed over a semiconductor substrate such that the first regions and second regions are interspersed laterally relative to a surface of the semiconductor substrate, the first regions comprising a first material and the second regions comprising a second material;
- depositing, by spin-on deposition in a first spin-coating module of a track system of an integrated processing system, a two-dimensional (2D) polymer material such that the 2D polymer material forms a 2D polymer film that is selectively deposited over surfaces of the first regions relative to surfaces of the second regions;
- depositing, by spin-on deposition in a second spin-coating module of the track system of the integrated processing system, a target material such that the target material is selectively deposited over surfaces of the second regions, the 2D polymer film inhibiting deposition of the target material over the surfaces of the first regions;
- and
- removing, using a wet removal process in a removal module of the track system of the integrated processing system, the 2D polymer film.
Dependencies are inferred from the claim text.