Method for manufacturing an electronic device comprising at least one superconductive zone and associated device

A method of manufacturing an electronic device, the electronic device comprising at least one superconducting zone and at least one insulating zone in a predefined arrangement, the method comprising carrying out sequentially in specific order the following method elements:

• depositing a first layer on at least part of a substrate, the first layer being a buffer layer,
• etching the first layer in the predefined arrangement to obtain at least one first zone and at least one second zone, each first zone being a zone in which the substrate is covered by the first layer and each first zone being intended to form a respective superconducting zone, each second zone being a zone in which the substrate is exposed and each second zone capable of forming a respective insulating zone,
• depositing a second layer over the entire substrate including the at least one first zone and the at least one second zone, the second layer comprising a superconducting material, and
• annealing the substrate, the first layer, and the second layer at a temperature of 200° C. or more,
• wherein the first layer is made of at least two superimposed sub-layers, wherein the superconducting material comprises a cuprate, the substrate being made of a material in which at least one chemical element of the superconducting material diffuses into the material of the substrate when the two materials are in contact and heated to a temperature of 200° C. or more.