Light-emitting device and method for manufacturing light-emitting device

A method for manufacturing a light-emitting device, the method comprising:

• providing a light-emitting element disposed on a substrate where an element electrode and the substrate are electrically joined through a conductive member, the substrate including wiring electrically connecting to the element electrode, the conductive member being connected to the element electrode of the light-emitting element and the wiring of the substrate, the light-emitting element including a first surface serving as a light extracting surface, a second surface serving as a bottom surface on which the element electrode is provided, and a lateral surface connecting the first surface and the second surface, disposing a light-transmissive member including a lateral surface positioned outward from the lateral surface of the light-emitting element by disposing an adhesive resin on the first surface of the light-emitting element, the adhesive resin forming a fillet on at least a part of the lateral surface of the light-emitting element;
• disposing an underfill on the substrate at a position proximate to a peripheral edge of the light-emitting element and on the substrate at a position facing the second surface of the light-emitting element;
• drying the substrate where the underfill is disposed at a temperature of 70° C. or lower;
• and
• disposing a light-reflective member directly or indirectly covering the substrate and the light-emitting element, wherein
• the disposing of the light-transmissive member includes disposing the adhesive resin between the first surface of the light-emitting element and the light-transmissive member, and disposing the adhesive resin on at least a part of the lateral surface of the light-emitting element, and
• the underfill is disposed in a state where the underfill is in contact with the lateral surface of the light-emitting element or the adhesive resin forming the fillet disposed on the lateral surface of the light-emitting element and is disposed on the substrate in a state where the underfill is separated from the second surface of the light-emitting element with a clearance by the drying of the substrate where the underfill is disposed.