# US 12,765,107 B2 · Chip package and manufacturing method thereof

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- Number: US 12,765,107 B2
- Document ID: US12765107B2
- Status: Granted
- Kind: B2
- Application number: 18/307,004
- Filed: 2023-04-26
- Published: 2023-11-16
- Granted: 2026-10-13
- Earliest claimed: 2022-05-14
- Assignees: Xintec Inc.
- Applicants: Xintec Inc.
- Inventors: Chia-Ming Cheng; Shu-Ming Chang
- Web page: https://patentgrep.com/patent/US12765107B2

## CPC

- H10F 55/18: {wherein the radiation-sensitive semiconductor devices and the electric light source share a common body having dual-functionality of light emission and light detection}
- H10F 55/20: wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F 71/137: {Batch treatment of the devices}
- H10F 77/30: Coatings (arrangements for preventing damage to photovoltaic cells caused by corpuscular radiation H10F77/80)
- H10F 77/413: {directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42)}
- H10F 77/93: {Interconnections}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

A chip package includes a chip, a first support layer, a light emitter, a first light transmissive sheet, a redistribution layer, and a conductive structure. A top surface of the chip has a conductive pad and a first light receiver. The first support layer is located on the top surface of the chip. The light emitter is located on the top surface of the chip. The first light transmissive sheet is located on the first support layer and covers the first light receiver. The redistribution layer is electrically connected to the conductive pad and extends to a bottom surface of the chip. The conductive structure is located on the redistribution layer that is on the bottom surface of the chip.

## Claims

### Claim 1

A chip package, comprising:
a chip, wherein a top surface of the chip has a conductive pad and a first light receiver;
a first support layer located on the top surface of the chip;
a light emitter located on the top surface of the chip;
a first light transmissive sheet located on a top surface of the first support layer and covering the first light receiver, wherein a top surface of the light emitter is higher than the top surface of the first support layer and a bottom surface of the first light transmissive sheet;
a transparent glue covering the light emitter, wherein an entire top surface of the transparent glue is coplanar with a top surface of the first light transmissive sheet;
a redistribution layer electrically connected to the conductive pad and extending to a bottom surface of the chip; and
a conductive structure located on the redistribution layer that is on the bottom surface of the chip.

### Claim 2 (depends on 1)

The chip package of claim 1, wherein a material of the first support layer comprises epoxy, and the first support layer surrounds the first light receiver.

### Claim 3 (depends on 1)

The chip package of claim 1, wherein the first support layer is an adhesive, and the first support layer overlaps the first light receiver in a vertical direction.

### Claim 4 (depends on 1)

The chip package of claim 1, further comprising:
an anti-reflection layer located on the bottom surface of the first light transmissive sheet.

### Claim 5 (depends on 4)

The chip package of claim 4, wherein the anti-reflection layer extends to a sidewall of the first light transmissive sheet proximal to the light emitter.

### Claim 6 (depends on 1)

The chip package of claim 1, wherein the top surface of the chip further has a second light receiver, and the light emitter is located between the first light receiver and the second light receiver.

### Claim 7 (depends on 6)

The chip package of claim 6, further comprising:
a second support layer located on the top surface of the chip; and
a second light transmissive sheet located on the second support layer and covering the second light receiver.

### Claim 8 (depends on 7)

The chip package of claim 7, further comprising:
an anti-reflection layer located on a bottom surface of the second light transmissive sheet.

### Claim 9 (depends on 8)

The chip package of claim 8, wherein the anti-reflection layer extends to a sidewall of the second light transmissive sheet proximal to the light emitter.

### Claim 10 (depends on 7)

The chip package of claim 7, wherein a material of the second support layer comprises epoxy, and the second support layer surrounds the second light receiver.

### Claim 11 (depends on 7)

The chip package of claim 7, wherein the second support layer is an adhesive, and the second support layer overlaps the second light receiver in a vertical direction.

### Claim 12 (depends on 1)

The chip package of claim 1, wherein the transparent glue is disposed on the top surface of the light emitter.

### Claim 13 (depends on 1)

The chip package of claim 1, wherein the chip has an inclined surface adjoining the top surface and the bottom surface of the chip, the conductive pad protrudes from the inclined surface, and an outer sidewall of the conductive pad is in contact with the redistribution layer.

### Claim 14 (depends on 13)

The chip package of claim 13, further comprising:
an isolation layer disposed along the inclined surface and the bottom surface of the chip, and located between the chip and the redistribution layer; and
an insulating layer covering a bottom surface of the redistribution layer and a bottom surface of the isolation layer, wherein the conductive structure protrudes from the insulating layer.

### Claim 15 (depends on 1)

The chip package of claim 1, wherein the chip has a through hole, the conductive pad is located in the through hole, and the redistribution layer extends into the through hole to be in contact with the conductive pad, and the chip package further comprises:
an isolation layer located between the bottom surface of the chip and the redistribution layer and between a sidewall of the through hole and the redistribution layer.

### Claim 16 (depends on 15)

The chip package of claim 15, further comprising:
an insulating layer located on a bottom surface of the redistribution layer and the bottom surface of the chip, and covering an opening of the through hole, wherein the conductive structure protrudes from the insulating layer.

### Claim 17

A manufacturing method of a chip package, comprising:
bonding a mother light transmissive sheet to a first support layer on a top surface of a wafer, wherein the top surface of the wafer has a conductive pad and a first light receiver, the mother light transmissive sheet covers the first light receiver and has a trench;
etching a bottom surface of the wafer to form a recess or a through hole that exposes the conductive pad;
forming a redistribution layer electrically connected to the conductive pad and extending to the bottom surface of the wafer;
forming a conductive structure on the redistribution layer on the bottom surface of the wafer;
grinding a top surface of the mother light transmissive sheet to form a first light transmissive sheet at one side of the trench, wherein the first light transmissive sheet is located on a top surface of the first support layer;
cutting the first light transmissive sheet, the first support layer, and the wafer such that the wafer forms a chip;
disposing a light emitter on a top surface of the chip, wherein a top surface of the light emitter is higher than the top surface of the first support layer and a bottom surface of the first light transmissive sheet; and
disposing a transparent glue to cover the light emitter, wherein an entire top surface of the transparent glue is coplanar with a top surface of the first light transmissive sheet.

### Claim 18 (depends on 17)

The manufacturing method of the chip package of claim 17, wherein the top surface of the wafer further has a second light receiver, bonding the mother light transmissive sheet to the first support layer on the top surface of the wafer is performed such that the mother light transmissive sheet is simultaneously bonded to a second support layer on the top surface of the wafer, and the mother light transmissive sheet covers the second support layer.

### Claim 19 (depends on 17)

The manufacturing method of the chip package of claim 17, further comprising:
forming an anti-reflection layer on a bottom surface of the mother light transmissive sheet.

### Claim 20 (depends on 19)

The manufacturing method of the chip package of claim 19, further comprising:
forming the anti-reflection layer on a sidewall of the trench of the mother light transmissive sheet.