Radiation imaging apparatus, radiation imaging system, and method of manufacturing radiation imaging apparatus

A method of manufacturing a radiation imaging apparatus in which a sensor substrate and a scintillator sealed by a protective layer configured by one or more layers are bonded by a bonding member, the method comprising:

• forming a scintillator on a first substrate;
• forming a first layer of the protective layer so as to cover the scintillator disposed on the first substrate;
• bonding the scintillator to a second substrate, which is the sensor substrate, such that the scintillator is disposed between the first substrate and the second substrate and such that only a first portion of the scintillator is bonded to the second substrate;
• separating the first substrate from the scintillator bonded to the second substrate such that only the first portion of the scintillator is separated from the first substrate and such that a second portion, which is different from the first portion, of the scintillator remains on the first substrate;
• and
• after the separating, forming a second layer of the protective layer so as to cover the first portion of the scintillator disposed on the second substrate.