# US 12,765,091 B2 · Image sensor and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,765,091 B2 - Document ID: US12765091B2 - Status: Granted - Kind: B2 - Application number: 18/407,163 - Filed: 2024-01-08 - Published: 2024-12-05 - Granted: 2026-10-13 - Earliest claimed: 2023-06-05 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Gyunha Park; Jonghyun Go; Ji-Youn Song; Keun Yeong Cho - Web page: https://patentgrep.com/patent/US12765091B2 ## CPC - H10F 39/8037: {the integrated elements comprising a transistor} - H10F 39/026: {Wafer-level processing} - H10F 39/811: {Interconnections} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract The present disclosure relates to image sensors. An example image sensor includes a first substrate, a transmission transistor, a second substrate, multiple transistors, multiple wires, and a deep node. The first substrate includes a first side, a second side facing the first side, and a photoelectric conversion area. The transmission transistor is disposed on the first side of the first substrate. The second substrate includes a first side and a second side facing each other. The transistors are disposed on the first side of the second substrate and connected with the transmission transistor. The wires are disposed on the second side of the second substrate. The deep node penetrates the second substrate. The first side of the first substrate and the first side of the second substrate face each other. The transistors and one or more wires are connected through the deep node. ## Claims ### Claim 1 An image sensor comprising: a first substrate, wherein the first substrate includes a first side, a second side, and a photoelectric conversion area, the first side and the second side of the first substrate facing each other; a transmission transistor disposed on the first side of the first substrate; a second substrate, wherein the second substrate includes a first side and a second side facing each other; a plurality of transistors disposed on the first side of the second substrate, wherein the plurality of transistors are connected with the transmission transistor; a plurality of wires disposed on the second side of the second substrate; and a deep node, wherein the deep node penetrates the second substrate, wherein the first side of the first substrate and the first side of the second substrate face each other, and wherein the plurality of transistors disposed on the first side of the second substrate and one or more wires of the plurality of wires disposed on the second side of the second substrate are connected through the deep node. ### Claim 2 (depends on 1) The image sensor of claim 1, further comprising a floating diffusion area disposed on the first substrate, wherein the floating diffusion area connects the transmission transistor to the plurality of transistors, and wherein the plurality of transistors disposed on the second substrate comprise: a reset transistor, wherein the reset transistor is configured to initialize the floating diffusion area; an amplification transistor, wherein a gate of the amplification transistor is connected with the floating diffusion area; and a selection transistor, wherein the selection transistor is connected with one end of the amplification transistor. ### Claim 3 (depends on 2) The image sensor of claim 2, wherein: the plurality of wires includes an output wire connected to one end of the selection transistor, and the output wire and the selection transistor are connected to each other through the deep node. ### Claim 4 (depends on 2) The image sensor of claim 2, wherein: the plurality of wires includes a power voltage transmission wire connected with one end of the reset transistor, and the power voltage transmission wire and the reset transistor are connected to each other through the deep node. ### Claim 5 (depends on 2) The image sensor of claim 2, wherein: the plurality of wires includes a power voltage transmission wire connected to one end of the amplification transistor, and the power voltage transmission wire and the amplification transistor are connected to each other through the deep node. ### Claim 6 (depends on 2) The image sensor of claim 2, wherein: the plurality of wires includes a wire connected with a gate of the reset transistor, and the gate of the reset transistor and the wire are connected to each other through the deep node. ### Claim 7 (depends on 2) The image sensor of claim 2, wherein: the plurality of wires includes a wire connected with a gate of the selection transistor, and the gate of the selection transistor and the wire are connected to each other through the deep node. ### Claim 8 (depends on 2) The image sensor of claim 2, further comprising a dual conversion transistor, wherein the dual conversion transistor connects the reset transistor to the floating diffusion area, wherein the plurality of wires includes a wire connected with a gate of the dual conversion transistor, and wherein the dual conversion transistor and the wire are connected to each other through the deep node. ### Claim 9 (depends on 1) The image sensor of claim 1, wherein: a first end of the deep node extends from the first side of the second substrate, and a second end of the deep node extends from the second side of the second substrate. ### Claim 10 (depends on 1) The image sensor of claim 1, further comprising a first floating diffusion area connection node disposed on the first substrate, wherein the image sensor comprises a plurality of pixels, wherein one pixel of the plurality of pixels includes eight photoelectric conversion area and eight transmission transistors, and wherein the eight transmission transistors are connected with the first floating diffusion area connection node. ### Claim 11 An image sensor comprising: a first substrate, wherein the first substrate includes a first side, a second side, and a photoelectric conversion area, the first side and the second side of the first substrate facing each other; a light transmission layer disposed on the second side of the first substrate; a transmission transistor disposed on the first side of the first substrate; a first wiring area disposed on the first side of the first substrate; a second substrate, wherein the second substrate includes a first side and a second side facing each other; a plurality of transistors disposed on the first side of the second substrate, wherein the plurality of transistors are connected with the transmission transistor; a second wiring area disposed on the second substrate; a third wiring area disposed on the second side of the second substrate; and a deep node, wherein the deep node penetrates the second substrate, wherein the first side of the first substrate and the first side of the second substrate face each other, and wherein part of a plurality of wirings disposed in the second wiring area and part of a plurality of wirings disposed in the third wiring area are connected through the deep node. ### Claim 12 (depends on 11) The image sensor of claim 11, wherein: a first end of the deep node extends from the first side of the second substrate, and a second end of the deep node extends from the second side of the second substrate. ### Claim 13 (depends on 11) The image sensor of claim 11, further comprising a third substrate, wherein the third substrate includes a first side and a second side facing each other, wherein the first side of the third substrate faces the second side of the second substrate, and wherein the image sensor further comprises a plurality of transistors and a fourth wiring area, the plurality of transistors disposed on the first side of the third substrate and the fourth wiring area disposed on the first side of the third substrate. ### Claim 14 (depends on 11) The image sensor of claim 11, wherein: a signal transmitted to a wire disposed in the third wiring area is transmitted to the plurality of transistors disposed in the first side of the second substrate through the deep node and a wire disposed in the second wiring area. ### Claim 15 A manufacturing method of an image sensor, comprising: preparing a first substrate, wherein the first substrate includes a first side, a second side, and a transmission transistor, the first side and the second side of the first substrate facing each other and a first wiring area disposed on the first side of the first substrate; preparing a second substrate, wherein the second substrate includes a first side, a second side, and a plurality of transistors, the first side and the second side of the second substrate facing each other and a second wiring area disposed on the first side of the second substrate; bonding the first substrate and the second substrate such that the first side of the first substrate and the first side of the second substrate face each other; forming a deep node, wherein the deep node penetrates the second substrate in a direction facing the first side of the second substrate from the second side of the second substrate; and forming a third wiring area on the second side of the second substrate, wherein part of a plurality of wirings disposed in the second wiring area and part of a plurality of wirings disposed in the third wiring area connected with each other through the deep node. ### Claim 16 (depends on 15) The manufacturing method of the image sensor of claim 15, wherein: a first end of the deep node extends from the first side of the second substrate, and a second end of the deep node extends from the second side of the second substrate. ### Claim 17 (depends on 15) The manufacturing method of the image sensor of claim 15, wherein: a wire disposed in the second wiring area serves as an etch stopper when forming the deep node. ### Claim 18 (depends on 15) The manufacturing method of the image sensor of claim 15, further comprising: preparing a third substrate, wherein the third substrate includes a first side, a second side, and a plurality of transistors, the first side and the second side of the third substrate facing each other and a fourth wiring area disposed on the first side of the third substrate; and bonding the second side of the second substrate and the first side of the third substrate to face each other. ### Claim 19 (depends on 15) The manufacturing method of the image sensor of claim 15, wherein: the first substrate further comprises a photoelectric conversion area and a floating diffusion area connecting the transmission transistor to the plurality of transistors, and the plurality of transistors disposed on the second substrate include: a reset transistor, wherein the reset transistor initializes the floating diffusion area; an amplification transistor, wherein a gate of the amplification transistor is connected with the floating diffusion area; and a selection transistor, wherein the selection transistor is connected with one end of the amplification transistor, and wherein one or more wires connected with the reset transistor, the amplification transistor, and the selection transistor are formed in the third wiring area. ### Claim 20 (depends on 15) The manufacturing method of the image sensor of claim 15, wherein the image sensor further comprises a first floating diffusion area connection node disposed in the first wiring area, wherein a second floating diffusion area connection node is connected in the second wiring area, and wherein the first floating diffusion area connection node and the second floating diffusion area connection node directly contact each other when bonding the first substrate and the second substrate.