# US 12,765,085 B2 · Image sensor device, equipment, and method of manufacturing image sensor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,765,085 B2 - Document ID: US12765085B2 - Status: Granted - Kind: B2 - Application number: 18/714,114 - Filed: 2022-10-13 - Published: 2025-01-16 - Granted: 2026-10-13 - Earliest claimed: 2021-12-06 - Assignees: Sony Semiconductor Solutions Corporation - Applicants: Sony Semiconductor Solutions Corporation - Inventors: Masami Suzuki - Web page: https://patentgrep.com/patent/US12765085B2 ## CPC - H10F 39/802: {Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes} - H10F 39/026: {Wafer-level processing} - H10F 39/811: {Interconnections} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract It is a main object to provide an image sensor device that can reduce the risks of damage to and/or contamination of its components during manufacturing. The image sensor device according to the present technology is an image sensor device including a substrate and a plurality of sensor units arranged in at least one axis direction on the substrate. Each of the plurality of sensor units includes a pixel chip including a plurality of pixels, and a translucent cover configured to cover the pixel chip. With the image sensor device according to the present technology, there can be provided an image sensor device that can reduce the risks of damage to and/or contamination of its components during manufacturing. ## Claims ### Claim 1 An image sensor device, comprising: a first substrate; a plurality of sensor units in at least one axis direction on the first substrate, wherein the at least one axis direction is with respect to the first substrate, and each sensor unit of the plurality of sensor units includes: a second substrate; a pixel chip on the second substrate, wherein the pixel chip includes a plurality of pixels; and a translucent cover configured to cover the pixel chip; and a positioning structure configured to position the first substrate and a corresponding sensor unit of the plurality of sensor units, wherein the positioning structure includes: a pin; a first bolt insertion hole in the first substrate; a pin insertion hole in each of the first substrate and the second substrate, wherein a first end portion of the pin is in the pin insertion hole of the first substrate, and a second end portion of the pin is inserted through the pin insertion hole of the second substrate; a second bolt insertion hole in the second substrate, wherein the second bolt insertion hole is at a position corresponding to the first bolt insertion hole of the first substrate; a bolt in each of the first bolt insertion hole and the second bolt insertion hole; and a nut that is threadedly engaged with the bolt. ### Claim 2 (depends on 1) The image sensor device according to claim 1, wherein the plurality of sensor units is in one axis direction of the at least one axis direction. ### Claim 3 (depends on 2) The image sensor device according to claim 2, wherein longitudinal directions of the first substrate and longitudinal directions of each sensor unit of the plurality of sensor units match the one axis direction. ### Claim 4 (depends on 1) The image sensor device according to claim 1, wherein the translucent cover has a plate shape, and each sensor unit of the plurality of sensor units further includes a spacer between the pixel chip and the translucent cover. ### Claim 5 (depends on 1) The image sensor device according to claim 1, wherein the pixel chip protrudes on at least one side in the at least one axis direction with respect to the second substrate. ### Claim 6 (depends on 5) The image sensor device according to claim 5, wherein the pixel chip protrudes on the at least one side with respect to the second substrate by a specific amount, and the specific amount corresponds to a difference between a linear expansion coefficient of the pixel chip and a linear expansion coefficient of the second substrate. ### Claim 7 (depends on 1) The image sensor device according to claim 1, wherein the pin insertion hole includes a round hole for insertion of the pin, the first bolt insertion hole and the second bolt insertion hole include elongated holes with a length in a transverse direction, the transverse direction is with respect to the first substrate, and the length of the elongated holes is greater than a diameter of a screw portion of the bolt. ### Claim 8 (depends on 1) The image sensor device according to claim 1, further comprising: a plurality of sets of first bolt insertion holes, including the first bolt insertion hole; and a plurality of sets of second bolt insertion holes, including the second bolt insertion hole, wherein the bolt includes a plurality of bolts corresponding to the plurality of sets of first bolt insertion holes and the plurality of sets of second bolt insertion holes, the positioning structure further includes at least one spacer through which at least one of the plurality of bolts is insertable, and the at least one spacer is between the first substrate and the second substrate. ### Claim 9 (depends on 1) The image sensor device according to claim 1, wherein the positioning structure further includes: a plurality of sets of first bolt insertion holes in the first substrate, the plurality of sets of first bolt insertion holes including the first bolt insertion hole; a plurality of sets of second bolt insertion holes in the second substrate, the plurality of sets of second bolt insertion holes including the second bolt insertion hole, wherein the plurality of sets of second bolt insertion holes is at respective positions corresponding to the plurality of sets of first bolt insertion holes; a plurality of bolts that are insertable through respective ones of the plurality of sets of first bolt insertion holes and the plurality of sets of second bolt insertion holes; and a plurality of nuts threadedly engaged with respective ones of the plurality of bolts. ### Claim 10 (depends on 9) The image sensor device according to claim 9, wherein the plurality of sets of first bolt insertion holes and the plurality of sets of second bolt insertion holes include elongated holes, and each elongated hole of the elongated holes has a length in a transverse direction greater than a diameter of screw portion of the bolt. ### Claim 11 (depends on 9) The image sensor device according to claim 9, wherein the plurality of sets of first bolt insertion holes includes at least three sets of first bolt insertion holes, the plurality of sets of second bolt insertion holes includes at least three sets of second bolt insertion holes, the plurality of bolts includes at least three bolts corresponding to both of the at least three sets of first bolt insertion holes and the at least three sets of second bolt insertion holes, the positioning structure further includes at least one spacer through which at least one of the at least three bolts is insertable, and the at least one spacer is between the first substrate and the second substrate. ### Claim 12 (depends on 1) The image sensor device according to claim 1, wherein the pixel chip is electrically connected to the second substrate by wire bonding. ### Claim 13 (depends on 1) The image sensor device according to claim 1, further comprising an electrode pad on an opposite side of a side of the second substrate, wherein the pixel chip further includes a pixel substrate and a pixel region, the plurality of pixels is in the pixel region, and the pixel substrate includes a through electrode to electrically connect the electrode pad to the second substrate. ### Claim 14 (depends on 1) The image sensor device according to claim 1, wherein each sensor unit of the plurality of sensor units is for imaging. ### Claim 15 (depends on 1) The image sensor device according to claim 1, wherein each sensor unit of the plurality of sensor units is for ranging. ### Claim 16 (depends on 1) The image sensor device according to claim 1, wherein the plurality of sensor units includes a first sensor unit for imaging and a second sensor unit for ranging. ### Claim 17 An equipment, comprising: an image sensor device, wherein the image sensor device comprises: a first substrate; a plurality of sensor units in at least one axis direction on the first substrate, wherein the at least one axis direction is with respect to the first substrate, and each sensor unit of the plurality of sensor units includes: a second substrate; a pixel chip on the second substrate, wherein the pixel chip includes a plurality of pixels; and a translucent cover configured to cover the pixel chip; and a positioning structure configured to position the first substrate and a corresponding sensor unit of the plurality of sensor units, wherein the positioning structure includes: a pin; a first bolt insertion hole in the first substrate; a pin insertion hole in each of the first substrate and the second substrate, wherein a first end portion of the pin is in the pin insertion hole of the first substrate, and a second end portion of the pin is inserted through the pin insertion hole of the second substrate; a second bolt insertion hole in the second substrate, wherein the second bolt insertion hole is at a position corresponding to the first bolt insertion hole of the first substrate; a bolt in each of the first bolt insertion hole and the second bolt insertion hole; and a nut that is threadedly engaged with the bolt. ### Claim 18 A method of manufacturing an image sensor device, the method comprising: mounting a plurality of sensor units in at least one axis direction on a first substrate, wherein the at least one axis direction is with respect to the first substrate, and each sensor unit of the plurality of sensor units includes: a second substrate; a pixel chip on the second substrate, wherein the pixel chip includes a plurality of pixels; and a translucent cover configured to cover the pixel chip; and positioning, by a positioning structure, the first substrate and a corresponding sensor unit of the plurality of sensor units, wherein the positioning structure includes: a pin; a first bolt insertion hole in the first substrate; a pin insertion hole in each of the first substrate and the second substrate, wherein a first end portion of the pin is in the pin insertion hole of the first substrate, and a second end portion of the pin is inserted through the pin insertion hole of the second substrate; a second bolt insertion hole in the second substrate, wherein the second bolt insertion hole is at a position corresponding to the first bolt insertion hole of the first substrate; a bolt in each of the first bolt insertion hole and the second bolt insertion hole; and a nut that is threadedly engaged with the bolt. ### Claim 19 (depends on 18) The method according to claim 18, wherein the mounting of the plurality of sensor units in the at least one axis direction on the first substrate includes: adjusting a position of each sensor unit of the plurality of sensor units with respect to the first substrate; and fixing the plurality of sensor units to the first substrate.