Semiconductor structure with curved surfaces
AssigneeMicron Technology, Inc.
InventorYenting Lin
Life of this patent
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AssigneeMicron Technology, Inc.
InventorYenting Lin
Estimating the term…
Methods, apparatuses, and systems related to semiconductor structure with curved surfaces are described. An example apparatus includes a semiconductor structure comprising a patterned material comprising active areas, a first conductive material on a surface of each active area, and a first metal material on a surface of each first conductive material. The patterned material further includes a second and third conductive material, a first nitride material, and a second nitride material separating each active area, first conductive material, and first metal material from each second and third conductive material, and first nitride material. The apparatus includes a curved surface formed on a portion of the first metal material and second nitride material. The apparatus further includes a first layer comprising an oxide material and a second metal material on the patterned material, where the oxide material contacts the curved surface.
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.