Cold plate with integrated sliding pedestal and processing system including the same

A processing system comprising:

• a first electronic component arranged over a printed circuit board (PCB), the first electronic component having a height in a first direction perpendicular to a major surface of the PCB;
• a thermal interface material (TIM) layer arranged over the first electronic component;
• a sliding pedestal arranged over the TIM layer, wherein the sliding pedestal is configured to be spaced a variable distance in the first direction from the PCB, wherein the sliding pedestal comprises:
• a pedestal body;
• a fin array enclosed within the pedestal body;
• and
• a bypass seal configured to guide flow of the coolant through the fin array;
• and
• a cold plate arranged over the sliding pedestal, the cold plate configured to cool a second electronic component and provide a coolant to the sliding pedestal to cool the first electronic component via the sliding pedestal and the TIM layer as the coolant flows through a coolant path of the sliding pedestal.

A system for cooling at least one integrated circuit die, comprising:

• a sliding pedestal dimensioned to cover an integrated circuit die arranged over a printed circuit board (PCB), the sliding pedestal comprising an inlet to receive a coolant, an outlet to output the coolant, and a coolant path between the inlet and the outlet;
• and
• a cold plate connectable with the sliding pedestal, the cold plate configured to provide the coolant to the sliding pedestal for cooling the integrated circuit die as the coolant flows through the coolant path of the sliding pedestal and to cool an electronic component,
• wherein the sliding pedestal is configured to move freely in a first direction perpendicular to a major surface of the cold plate while maintaining a fluid seal between the cold plate and each of the inlet and the outlet of the sliding pedestal.