# US 12,764,901 B2 · Heat dissipation apparatus and server > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,764,901 B2 - Document ID: US12764901B2 - Status: Granted - Kind: B2 - Application number: 18/785,125 - Filed: 2024-07-26 - Published: 2024-11-21 - Granted: 2026-10-13 - Earliest claimed: 2022-01-27 - Assignees: Huawei Technologies Co., Ltd. - Applicants: Huawei Technologies Co., Ltd. - Inventors: Dingfang Li; Hui Jia; Gaoliang Xia - Web page: https://patentgrep.com/patent/US12764901B2 ## CPC - H05K 7/20254: {Cold plates transferring heat from heat source to coolant} - H05K 7/20772: {within server blades for removing heat from heat source} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A heat dissipation apparatus includes: a cover plate, a flow distribution plate, and a heat dissipation member. A first flow inlet and outlet are disposed in the cover plate, a flow inlet cavity and a flow outlet cavity that are isolated from each other are disposed in the cover plate, the first flow inlet and outlet communicate with the flow inlet and outlet cavity respectively. The heat dissipation member includes a heat dissipation portion, where a heat dissipation flow channel is formed. A second flow inlet and second flow outlets are provided in the flow distribution plate, the second flow inlet communicates with the flow inlet cavity and the heat dissipation flow channel. The second flow outlets are respectively located at the two ends of the heat dissipation flow channel, and communicate with the heat dissipation flow channel and the flow outlet cavity. ## Claims ### Claim 1 A heat dissipation apparatus, configured to dissipate heat for a chip, and comprising a cover plate, a flow distribution plate, and a heat dissipation member, wherein a first flow inlet and a first flow outlet are disposed in the cover plate, a flow inlet cavity and a flow outlet cavity that are isolated from each other are disposed in the cover plate, the first flow inlet is configured to communicate with the flow inlet cavity, the first flow outlet is configured to communicate with the flow outlet cavity, and the cover plate is connected to a top face of the flow distribution plate in a sealed manner; the heat dissipation member is connected to a bottom face of the flow distribution plate in a sealed manner, the heat dissipation member and the flow distribution plate form a sealed cavity, the heat dissipation member comprises a heat dissipation portion, the heat dissipation portion is located in the sealed cavity, and a heat dissipation flow channel is formed in the heat dissipation portion; a second flow inlet and at least two second flow outlets are provided in the flow distribution plate, the second flow inlet is configured to communicate with the flow inlet cavity and the heat dissipation flow channel, and the second flow inlet is located between two ends of the heat dissipation flow channel; and two of the at least two second flow outlets are respectively located at the two ends of the heat dissipation flow channel, and the at least two second flow outlets communicate with the heat dissipation flow channel and the flow outlet cavity. ### Claim 2 (depends on 1) The heat dissipation apparatus according to claim 1, wherein the heat dissipation member further comprises a bearing plate, the heat dissipation portion is disposed on the bearing plate, the bearing plate is connected to the flow distribution plate in a sealed manner, and the bearing plate and the flow distribution plate are enclosed to form the sealed cavity; the bearing plate, an end face of the heat dissipation portion, and the flow distribution plate are enclosed to form two confluence cavities, the two confluence cavities are respectively located at the two ends of the heat dissipation flow channel, and the two confluence cavities both communicate with the heat dissipation flow channel; one of the at least two second flow outlets is configured to communicate with one of the two confluence cavities and the flow outlet cavity; and an other of the at least two second flow outlets is configured to communicate with an other of the two confluence cavities and the flow outlet cavity. ### Claim 3 (depends on 2) The heat dissipation apparatus according to claim 2, wherein the flow distribution plate comprises: a flow distribution plate main body and an isolation plate extending toward the bearing plate, the isolation plate covers the bearing plate and is welded to the bearing plate in a sealed manner; a top of the heat dissipation portion is welded to the flow distribution plate main body; and the isolation plate, the flow distribution plate main body, the bearing plate, and the end face of the heat dissipation portion are enclosed to form the two confluence cavities. ### Claim 4 (depends on 1) The heat dissipation apparatus according to claim 1, wherein the flow inlet cavity comprises: a direct flow cavity and a cyclone flow cavity that is configured to communicate with the direct flow cavity; the direct flow cavity is configured to communicate with the first flow inlet, and the second flow inlet is configured to communicate with the cyclone flow cavity and the heat dissipation flow channel; and the cyclone flow cavity is configured to perform cyclone flow acceleration on a fluid. ### Claim 5 (depends on 1) The heat dissipation apparatus according claim 1, further comprising a bracket, wherein the bracket is assembled on a mainboard on which the chip is mounted; and a mounting hole is provided in the bracket, the heat dissipation member is assembled in the mounting hole, and the flow distribution plate is connected to the bracket. ### Claim 6 (depends on 1) The heat dissipation apparatus according to claim 1, wherein the first flow inlet and the first flow outlet are disposed in a side wall of the cover plate. ### Claim 7 (depends on 1) The heat dissipation apparatus according to claim 1, wherein the flow distribution plate comprises a flow distribution plate main body; the heat dissipation flow channel comprises a plurality of heat dissipation flow sub-channels, the heat dissipation portion comprises a plurality of fins, and the plurality of heat dissipation flow sub-channels are formed between the plurality of fins; and tops of the plurality of fins are welded to the flow distribution plate main body. ### Claim 8 (depends on 1) The heat dissipation apparatus according to claim 1, wherein the heat dissipation member is configured to be in contact with the chip to dissipate heat for the chip. ### Claim 9 (depends on 2) The heat dissipation apparatus according to claim 2, wherein a cross section of the bearing plate and a cross section of the heat dissipation portion are both rectangular. ### Claim 10 (depends on 1) The heat dissipation apparatus according to claim 1, wherein a size of the second flow inlet provided in the flow distribution plate is larger than a size of each of the at least two second flow outlets provided in the flow distribution plate. ### Claim 11 A server, comprising a mainboard, a chip disposed on the mainboard, and a heat dissipation apparatus, wherein the heat dissipation apparatus is configured to dissipate heat for the chip; wherein the heat dissipation apparatus is configured to dissipate heat for the chip, and comprises a cover plate, a flow distribution plate, and a heat dissipation member, wherein a first flow inlet and a first flow outlet are disposed in the cover plate, a flow inlet cavity and a flow outlet cavity that are isolated from each other are disposed in the cover plate, the first flow inlet is configured to communicate with the flow inlet cavity, the first flow outlet is configured to communicate with the flow outlet cavity, and the cover plate is connected to a top face of the flow distribution plate in a sealed manner; the heat dissipation member is connected to a bottom face of the flow distribution plate in a sealed manner, the heat dissipation member and the flow distribution plate form a sealed cavity, the heat dissipation member comprises a heat dissipation portion, the heat dissipation portion is located in the sealed cavity, and a heat dissipation flow channel is formed in the heat dissipation portion; a second flow inlet and at least two second flow outlets are provided in the flow distribution plate, the second flow inlet is configured to communicate with the flow inlet cavity and the heat dissipation flow channel, and the second flow inlet is located between two ends of the heat dissipation flow channel; and two of the at least two second flow outlets are respectively located at the two ends of the heat dissipation flow channel, and the at least two second flow outlets communicate with the heat dissipation flow channel and the flow outlet cavity. ### Claim 12 (depends on 11) The server according to claim 11, wherein the heat dissipation member further comprises a bearing plate, the heat dissipation portion is disposed on the bearing plate, the bearing plate is connected to the flow distribution plate in a sealed manner, and the bearing plate and the flow distribution plate are enclosed to form the sealed cavity; the bearing plate, an end face of the heat dissipation portion, and the flow distribution plate are enclosed to form two confluence cavities, the two confluence cavities are respectively located at the two ends of the heat dissipation flow channel, and the two confluence cavities both communicate with the heat dissipation flow channel; one of the at least two second flow outlets is configured to communicate with one of the two confluence cavities and the flow outlet cavity; and an other of the at least two second flow outlets is configured to communicate with an other of the two confluence cavities and the flow outlet cavity. ### Claim 13 (depends on 12) The server according to claim 12, wherein the flow distribution plate comprises: a flow distribution plate main body and an isolation plate extending toward the bearing plate, the isolation plate covers the bearing plate and is welded to the bearing plate in a sealed manner; a top of the heat dissipation portion is welded to the flow distribution plate main body; and the isolation plate, the flow distribution plate main body, the bearing plate, and the end face of the heat dissipation portion are enclosed to form the two confluence cavities. ### Claim 14 (depends on 11) The server according to claim 11, wherein the flow inlet cavity comprises: a direct flow cavity and a cyclone flow cavity that is configured to communicate with the direct flow cavity; the direct flow cavity is configured to communicate with the first flow inlet, and the second flow inlet is configured to communicate with the cyclone flow cavity and the heat dissipation flow channel; and the cyclone flow cavity is configured to perform cyclone flow acceleration on a fluid. ### Claim 15 (depends on 11) The server according claim 11, further comprising a bracket, wherein the bracket is assembled on the mainboard on which the chip is mounted; and a mounting hole is provided in the bracket, the heat dissipation member is assembled in the mounting hole, and the flow distribution plate is connected to the bracket. ### Claim 16 (depends on 11) The server according to claim 11, wherein the first flow inlet and the first flow outlet are disposed in a side wall of the cover plate. ### Claim 17 (depends on 11) The server according to claim 11, wherein the flow distribution plate comprises: a flow distribution plate main body; the heat dissipation flow channel comprises a plurality of heat dissipation flow sub-channels, the heat dissipation portion comprises a plurality of fins, and the plurality of heat dissipation flow sub-channels are formed between the plurality of fins; and tops of the plurality of fins are welded to the flow distribution plate main body. ### Claim 18 (depends on 11) The server according to claim 11, wherein the heat dissipation member is configured to be in contact with the chip to dissipate heat for the chip. ### Claim 19 (depends on 12) The server according to claim 12, wherein a cross section of the bearing plate and a cross section of the heat dissipation portion are both rectangular. ### Claim 20 (depends on 11) The server according to claim 11, wherein a size of the second flow inlet provided in the flow distribution plate is larger than a size of each of the at least two second flow outlets provided in the flow distribution plate.