Cooling system with multiple thermosyphon devices

A cooling system, comprising:

• a first liquid cooling plate, the first liquid cooling plate having a first left side flow channel and a first right side flow channel, the first left side flow channel and the first right side flow channel being connected in parallel to form a first parallel flow channel;
• a second liquid cooling plate, the first liquid cooling plate and the second liquid cooling plate being spaced apart and opposite to each other, the second liquid cooling plate having a second left side flow channel and a second right side flow channel, the second left side flow channel and the second right side flow channel being connected in parallel to form a second parallel flow channel, the first parallel flow channel and the second parallel flow channel being connected in series;
• a first thermosiphon device, the first thermosiphon device being located between the first left side flow channel and the second left side flow channel and being thermally coupled to the first liquid cooling plate and the second liquid cooling plate;
• and
• a second thermosiphon device, the second thermosiphon device being located between the first right side flow channel and the second right side flow channel and being thermally coupled to the first liquid cooling plate and the second liquid cooling plate.