# US 12,764,871 B2 · Bio-implantable device and fabricating method of the same

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- Number: US 12,764,871 B2
- Document ID: US12764871B2
- Status: Granted
- Kind: B2
- Application number: 18/930,748
- Filed: 2024-10-29
- Published: 2026-04-30
- Granted: 2026-10-13
- Earliest claimed: 2024-10-29
- Assignees: Qingding Precision Electronics (Huia'an) Co., Ltd.; Avary Holding (Shenzhen) Co., Limited.; Garuda Technology Co., Ltd.
- Applicants: QingDing Precision Electronics (Huai'an) Co., Ltd.; Avary Holding (Shenzhen) Co., Ltd.; Garuda Technology Co., Ltd.
- Inventors: Wan-Ling Xu; Kuan-Ying Chen
- Web page: https://patentgrep.com/patent/US12764871B2

## CPC

- H05K 3/321: by conductive adhesives
- H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 3/4611: {by laminating two or more circuit boards (H05K3/4652 takes precedence)}
- G06F 3/015: {Input arrangements based on nervous system activity detection, e.g. brain waves [EEG] detection, electromyograms [EMG] detection, electrodermal response detection}
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- H05K 2201/10151: Sensor
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

A bio-implantable device and a fabricating method of the same are provided. The bio-implantable device includes a flexible circuit board, a sensor, an elastic conductive layer, an electrode structure, and an elastic insulating layer. The flexible circuit board includes a wiring layer. The sensor is disposed on the wiring layer. The elastic conductive layer covers the sensor. The electrode structure is disposed on the elastic conductive layer and is configured to collect an electric signal from a creature. The electrode structure is electrically connected to the sensor through the elastic conductive layer. The elastic insulating layer covers the flexible circuit board and exposes the electrode structure and the elastic conductive layer.

## Claims

### Claim 1

A bio-implantable device, comprising:
a flexible circuit board comprising a wiring layer;
a sensor disposed on the wiring layer;
a first elastic conductive layer covering the sensor;
an electrode structure disposed on the first elastic conductive layer and configured to collect an electric signal from a creature, wherein the electrode structure is electrically connected to the sensor through the first elastic conductive layer; and
an elastic insulating layer covering the flexible circuit board and exposing the electrode structure and the first elastic conductive layer.

### Claim 2 (depends on 1)

The bio-implantable device of claim 1, further comprising:
a processor disposed inside the flexible circuit board and electrically connected to the sensor.

### Claim 3 (depends on 2)

The bio-implantable device of claim 2, further comprising:
a transceiver disposed on the flexible circuit board and electrically connected to the processor.

### Claim 4 (depends on 3)

The bio-implantable device of claim 3, further comprising:
a second elastic conductive layer, and
wherein the transceiver comprises:
a radio frequency element disposed on the wiring layer, wherein the second elastic conductive layer covers the radio frequency element; and
an antenna disposed on the second elastic conductive layer, wherein the antenna is electrically connected to the radio frequency element through the second elastic conductive layer.

### Claim 5 (depends on 4)

The bio-implantable device of claim 4, wherein the elastic insulating layer exposes the transceiver and the second elastic conductive layer.

### Claim 6 (depends on 5)

The bio-implantable device of claim 5, wherein a thickness of the elastic insulating layer is identical to a thickness of the second elastic conductive layer, and a surface of the elastic insulating layer is flush with a surface of the second elastic conductive layer at a junction of the elastic insulating layer and the second elastic conductive layer.

### Claim 7 (depends on 5)

The bio-implantable device of claim 5, wherein a thickness of the elastic insulating layer is greater than a thickness of the second elastic conductive layer, and the elastic insulating layer covers an edge of the second elastic conductive layer at a junction of the elastic insulating layer and the second elastic conductive layer.

### Claim 8 (depends on 1)

The bio-implantable device of claim 1, wherein a material of the first elastic conductive layer comprises an electroactive polymer.

### Claim 9 (depends on 1)

The bio-implantable device of claim 1, wherein a material of the elastic insulating layer comprises a polymer.

### Claim 10 (depends on 1)

The bio-implantable device of claim 1, further comprising:
a conductive adhesive layer disposed between the electrode structure and the first elastic conductive layer, wherein the electrode structure and the first elastic conductive layer are bonded and electrically conductive.

### Claim 11 (depends on 1)

The bio-implantable device of claim 1, wherein a thickness of the elastic insulating layer is identical to a thickness of the first elastic conductive layer, and a surface of the elastic insulating layer is flush with a surface of the first elastic conductive layer at a junction of the elastic insulating layer and the first elastic conductive layer.

### Claim 12 (depends on 1)

The bio-implantable device of claim 1, wherein a thickness of the elastic insulating layer is greater than a thickness of the first elastic conductive layer, and the elastic insulating layer covers an edge of the first elastic conductive layer at a junction of the elastic insulating layer and the first elastic conductive layer.

### Claim 13

A fabricating method of a bio-implantable device, comprising:
providing a flexible circuit board, wherein the flexible circuit board comprises a wiring layer;
disposing a sensor on the wiring layer;
forming a first elastic conductive layer to cover the sensor after disposing the sensor;
forming an elastic insulating layer to cover the flexible circuit board and to expose the first elastic conductive layer after forming the first elastic conductive layer; and
disposing an electrode structure on the first elastic conductive layer after forming the first elastic conductive layer, wherein the electrode structure is electrically connected to the sensor through the first elastic conductive layer.

### Claim 14 (depends on 13)

The fabricating method of the bio-implantable device of claim 13, wherein a step of providing the flexible circuit board comprises:
providing a first flexible baseboard, wherein the first flexible baseboard comprises a metal layer;
patterning the metal layer to form the wiring layer;
providing a second flexible baseboard;
forming a groove on the second flexible baseboard;
disposing a processor in the groove; and
combining the first flexible baseboard and the second flexible baseboard to form the flexible circuit board after disposing the processor and forming the wiring layer, wherein the first flexible baseboard covers the processor and the processor is located in the flexible circuit board.

### Claim 15 (depends on 13)

The fabricating method of the bio-implantable device of claim 13, further comprising:
disposing a radio frequency element on the wiring layer before forming the elastic insulating layer;
forming a second elastic conductive layer on the radio frequency element after disposing the radio frequency element and before forming the elastic insulating layer, wherein the second elastic conductive layer covers the radio frequency element; and
disposing an antenna on the second elastic conductive layer, wherein the antenna is electrically connected to the radio frequency element through the second elastic conductive layer, and the elastic insulating layer exposes the second elastic conductive layer and the antenna.

### Claim 16 (depends on 13)

The fabricating method of the bio-implantable device of claim 13, further comprising:
forming a conductive adhesive layer on the first elastic conductive layer before disposing the electrode structure on the first elastic conductive layer, wherein the conductive adhesive layer is bonded to the first elastic conductive layer and the electrode structure, and is electrically conductive to the first elastic conductive layer and the electrode structure.