Loading patent…
AssigneeFict Limited
InventorsTaiji Sakai, Kenji Iida, Norikazu Ozaki, Kenji Takano, Takashi Nakagawa, Takayuki Inaba, Tetsuro Miyagawa, Akira Yajima, Shin Hirano, Kota Aoi, Yoichi Abe, Mio Emura
Estimating the term…
An object is to provide a circuit board that includes a built-in semiconductor device and has a configuration that prevents cracking and has excellent reliability in operation over a wide temperature range. As a solution, a circuit board (10A) has a configuration in which a first insulating substrate (1) is laminated on a second insulating substrate (2) while interposing a first adhesive layer (7a), and a semiconductor device (9) is embedded in an embedment portion (1c) formed in the first insulating substrate (1).
A circuit board being a multilayer wiring board in which insulating substrates which are made of glass as an inorganic material on which metal layers are formed are laminated while interposing heat-resistant adhesive layers, comprising a configuration in which an embedment portion penetrated in a laminating direction in a first insulating substrate of the insulating substrates made of the glass as the inorganic material is formed and a semiconductor device is embedded in the embedment portion with an upper surface of the semiconductor device exposed, wherein the adhesive layers contain a thermoplastic resin, the semiconductor device is an optical device, a first external electrode provided on a lower surface in the laminating direction of the optical device is configured to be connected by conductive paste to a second insulating substrate of the insulating substrates made of the glass as the inorganic material, and a first electronic component is mounted on the first insulating substrate, an optical waveguide is formed on the first insulating substrate, the first electronic component is directly connected to a second external electrode provided on the exposed upper surface in the laminating direction of the optical device without interposing the first insulating substrate, and the optical device is coupled to the optical waveguide.
A method for manufacturing a circuit board being a multilayer wiring board by laminating insulating substrates which are made of glass as an inorganic material on which metal layers are formed while interposing heat-resistant adhesive layers wherein an embedment portion penetrated in a laminating direction in a first insulating substrate of the insulating substrates made of the glass as the inorganic material is formed, and a semiconductor device is embedded in the embedment portion with an upper surface of the semiconductor device exposed, and the adhesive layers contain a thermoplastic resin, the semiconductor device is an optical device, and the method for manufacturing a circuit board comprising:
Dependencies are inferred from the claim text.