Back to results
US 12,764,866 B2Granted
Mounting board
AssigneePanasonic Automotive Systems Co., Ltd.
InventorMitsunori Hayasaka
Life of this patent
Estimating the term…
Abstract
There is provided a mounting board including: a printed board; an electronic component surface-mounted on the printed board; and a resin for a sidefill applied to an outer periphery of the electronic component. At least one of the printed board and the electronic component includes a through-hole connected to a space defined by the printed board, the electronic component, and the resin for the sidefill.
Claims12
A mounting board comprising:
- a printed board;
- an electronic component surface-mounted on the printed board;
- and
- a resin for a sidefill applied to an outer periphery of the electronic component,
- wherein
- at least one of the printed board and the electronic component includes a through-hole connected to a space defined by the printed board, the electronic component, and the resin for the sidefill,
- the electronic component is a quad flat non-leaded package (QFN),
- the through-hole of the printed board is provided to avoid a GND land of the QFN, and
- the GND land has a size that is smaller than a size of a GND terminal of the QFN joined to the GND land by solder.
6 more elements
Dependencies are inferred from the claim text.