Multi-channel memory module

A dual-inline memory module (DIMM) comprising:

• a printed circuit board (PCB) having a first face, a second face, and an edge to be received by a DIMM connector;
• a plurality of DRAM chips on each of the first and second faces of the PCB;
• a bottom row of conductive contacts on each of the first and second faces of the PCB at the edge of the PCB to be received by the DIMM connector;
• and
• a top row of conductive contacts on each of the first and second faces of the PCB, wherein the top row is aligned over and parallel to the bottom row of conductive contacts, wherein the bottom rows and the top rows of conductive contacts on the first face of the PCB are to only couple with a first memory channel, and the bottom rows and the top rows of conductive contacts on the second face of the PCB are to couple only with a second memory channel.

A system comprising:

• a processor;
• and
• a memory module coupled with the processor, the memory module including:
• a printed circuit board (PCB) having a first face, a second face, and a first edge to be received by a connector;
• a plurality of memory chips on at least one of the first and second faces of the PCB;
• and
• two rows of conductive contacts on each of the first and second faces of the PCB, the two rows including a first row of conductive contacts proximate to the first edge of the PCB to be received by the connector, and a second row of conductive contacts between the first row and a second edge of the PCB opposite to the first edge, wherein the first and second rows of conductive contacts on the first face of the PCB are to couple only with a first memory channel, and the first and second rows of conductive contacts on the second face of the PCB are to couple only with a second memory channel.