# US 12,764,855 B2 · Bendable circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,764,855 B2 - Document ID: US12764855B2 - Status: Granted - Kind: B2 - Application number: 18/928,907 - Filed: 2024-10-28 - Published: 2026-04-30 - Granted: 2026-10-13 - Earliest claimed: 2024-10-28 - Assignees: Hongqisheng Precision Electronics (Quinhuangdao) Co., Ltd.; Avary Holding (Shenzhen) Co., Limited.; Garuda Technology Co., Ltd. - Applicants: HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.; Avary Holding (Shenzhen) Co., Ltd.; Garuda Technology Co., Ltd. - Inventors: Cheng-Jia Li - Web page: https://patentgrep.com/patent/US12764855B2 ## CPC - H05K 1/0283: {Stretchable printed circuits} - H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 2201/0314: Elastomeric connector or conductor, e.g. rubber with metallic filler - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A bendable circuit board includes a first structure and a second structure. The first structure includes a first insulation layer, a first insulation extension material, a first conductive layer and a first conductive extension feature. The first insulation extension material surrounds the first insulation layer. The first conductive layer includes a first conductive feature and a second conductive feature. The first conductive extension feature connects the first conductive feature to the second conductive feature. The second structure is bonded to the first structure, and includes a second insulation layer, a second insulation extension material, a second conductive layer and a second conductive extension feature. The second insulation extension material surrounds the second insulation layer. The second conductive layer includes a third conductive feature and a fourth conductive feature. The second conductive extension feature connects the third conductive feature to the fourth conductive feature. ## Claims ### Claim 1 A bendable circuit board, comprising: a first structure, comprising: a first insulation layer; a first insulation extension material surrounding the first insulation layer, wherein an elongation rate of the first insulation extension material is greater than an elongation rate of the first insulation layer; a first conductive layer comprising a first conductive feature and a second conductive feature, wherein the first conductive feature is inside the first insulation layer, and the second conductive feature is inside the first insulation extension material; and a first conductive extension feature extending along a horizontal direction and connecting the first conductive feature to the second conductive feature, wherein an elongation rate of the first conductive extension feature is greater than an elongation rate of the first conductive layer; and a second structure bonded to the first structure along a vertical direction, wherein the first structure and the second structure have a cavity therebetween, wherein the second structure comprises: a second insulation layer; a second insulation extension material surrounding the second insulation layer, wherein an elongation rate of the second insulation extension material is greater than an elongation rate of the second insulation layer; a second conductive layer comprising a third conductive feature and a fourth conductive feature, wherein the third conductive feature is inside the second insulation layer, and the fourth conductive feature is inside the second insulation extension material; and a second conductive extension feature extending along the horizontal direction and connecting the third conductive feature to the fourth conductive feature, wherein an elongation rate of the second conductive extension feature is greater than an elongation rate of the second conductive layer. ### Claim 2 (depends on 1) The bendable circuit board of claim 1, wherein the first conductive layer comprises a fifth conductive feature inside the first insulation layer, the fifth conductive feature is separated from the first conductive feature, and the fifth conductive feature is electrically disconnected from the second conductive feature. ### Claim 3 (depends on 1) The bendable circuit board of claim 1, further comprising: a third conductive extension feature extending along the vertical direction and connecting the second conductive feature to the fourth conductive feature, wherein an elongation rate of the third conductive extension feature is greater than the elongation rate of the first conductive layer or the elongation rate of the second conductive layer. ### Claim 4 (depends on 1) The bendable circuit board of claim 1, wherein the first conductive feature of the first conductive layer is misaligned with the third conductive feature of the second conductive layer along the vertical direction. ### Claim 5 (depends on 1) The bendable circuit board of claim 1, wherein the first conductive feature extends beyond a surface of the first insulation layer facing the cavity along the vertical direction. ### Claim 6 (depends on 1) The bendable circuit board of claim 1, wherein the first insulation layer extends beyond a surface of the first insulation extension material facing the cavity along the vertical direction. ### Claim 7 (depends on 1) The bendable circuit board of claim 1, wherein the first insulation layer extends beyond a surface of the first insulation extension material facing away from the cavity along the vertical direction. ### Claim 8 (depends on 1) The bendable circuit board of claim 1, wherein the first conductive extension feature is in direct contact with the first insulation layer and the first insulation extension material. ### Claim 9 (depends on 1) The bendable circuit board of claim 1, wherein the first insulation layer spaces the first insulation extension material apart from the first conductive feature. ### Claim 10 (depends on 1) The bendable circuit board of claim 1, wherein a thickness of the first conductive layer in the vertical direction is greater than a thickness of the first conductive extension feature in the vertical direction. ### Claim 11 (depends on 1) The bendable circuit board of claim 1, wherein the second conductive layer comprises a sixth conductive feature inside the second insulation layer, the sixth conductive feature is spaced apart from the third conductive feature, and the sixth conductive feature is electrically disconnected from the fourth conductive feature. ### Claim 12 (depends on 1) The bendable circuit board of claim 1, wherein the third conductive feature extends beyond a surface of the second insulation layer facing the cavity along the vertical direction. ### Claim 13 (depends on 1) The bendable circuit board of claim 1, wherein the second insulation layer extends beyond a surface of the second insulation extension material facing the cavity along the vertical direction. ### Claim 14 (depends on 1) The bendable circuit board of claim 1, wherein the second insulation layer extends beyond a surface of the second insulation extension material facing away from the cavity along the vertical direction. ### Claim 15 A bendable circuit board, comprising: a first structure, comprising: a first insulation layer; a first insulation extension material surrounding the first insulation layer, wherein an elongation rate of the first insulation extension material is greater than an elongation rate of the first insulation layer; a first conductive layer comprising a first conductive feature and a second conductive feature, wherein the first conductive feature is inside the first insulation layer, and the second conductive feature is inside the first insulation extension material; and a first conductive extension feature extending along a horizontal direction, and connecting the first conductive feature to the second conductive feature, wherein an elongation rate of the first conductive extension feature is greater than an elongation rate of the first conductive layer; and a second structure bonded to the first structure along a vertical direction, wherein the first structure and the second structure have a cavity therebetween, wherein the second structure comprises: a second insulation layer; a second insulation extension material surrounding the second insulation layer, wherein an elongation rate of the second insulation extension material is greater than an elongation rate of the second insulation layer; a second conductive layer comprising a third conductive feature and a fourth conductive feature, wherein the third conductive feature is inside the second insulation layer, and the fourth conductive feature is inside the second insulation extension material; and a second conductive extension feature extending along the horizontal direction, and connecting the third conductive feature to the fourth conductive feature, wherein an elongation rate of the second conductive extension feature is greater than an elongation rate of the second conductive layer; and a third conductive extension feature extending along the vertical direction and connecting the second conductive feature to the fourth conductive feature.