# US 12,764,853 B2 · Flexible hybrid interconnect circuits > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,764,853 B2 - Document ID: US12764853B2 - Status: Granted - Kind: B2 - Application number: 18/774,682 - Filed: 2024-07-16 - Published: 2024-11-07 - Granted: 2026-10-13 - Earliest claimed: 2018-10-29 - Assignees: CelLink Corporation - Applicants: CelLink Corporation - Inventors: Kevin Michael Coakley; Malcolm Parker Brown; Jose Juarez; Emily Hernandez; Joseph Pratt; Peter Stone; Vidya Viswanath; Will Findlay - Web page: https://patentgrep.com/patent/US12764853B2 ## CPC - H05K 1/0219: {Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors} - H01B 11/00: Communication cables or conductors - H05K 1/0237: {High frequency adaptations (H05K1/0216 takes precedence)} - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H05K 1/0326: {containing O} - H05K 2201/0145: Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit. ## Claims ### Claim 1 A flexible interconnect circuit having a length, a width, a thickness, and an aspect ratio defined as a ratio of the width to the thickness, the flexible interconnect circuit comprising: a first dielectric; a second dielectric; a first conductive element disposed between the first dielectric and the second dielectric; and a second conductive element disposed between the first dielectric and the second dielectric and stacked with the first conductive element along the thickness of the flexible interconnect circuit, wherein: the first conductive element is positioned between the first dielectric and the second conductive element, the second conductive element is positioned between the second dielectric and the first conductive element, the second conductive element comprises aluminum and has a thickness between about 10 micrometers and 1000 micrometers, the first dielectric and the second dielectric conform around a stack comprising at least the first conductive element and the second conductive element, the first dielectric and the second dielectric form edge portions around the stack such that the stack is positioned between the edge portions along the width of the flexible interconnect circuit, and the first dielectric and the second dielectric are directly bonded to each other in the edge portions. ### Claim 2 (depends on 1) The flexible interconnect circuit of claim 1, wherein the second dielectric comprises polypropylene. ### Claim 3 (depends on 1) The flexible interconnect circuit of claim 1, wherein the second dielectric comprises a thermally conductive filler. ### Claim 4 (depends on 1) The flexible interconnect circuit of claim 1, further comprising a thermally conductive adhesive disposed on the second dielectric and facing away from the first dielectric. ### Claim 5 (depends on 1) The flexible interconnect circuit of claim 1, wherein the aspect ratio of the flexible interconnect circuit is at least about 5. ### Claim 6 (depends on 1) The flexible interconnect circuit of claim 1, further comprising an inner dielectric that is partially disposed between the first conductive element and the second conductive element and that provides support to the first conductive element and the second conductive element relative to each other. ### Claim 7 (depends on 1) The flexible interconnect circuit of claim 1, further comprising a third conductive element, wherein: the third conductive element is stacked with the first conductive element and the second conductive element along the thickness of the flexible interconnect circuit. ### Claim 8 (depends on 7) The flexible interconnect circuit of claim 7, wherein the third conductive element comprises aluminum and has a thickness between about 10 micrometers and 1000 micrometers. ### Claim 9 (depends on 7) The flexible interconnect circuit of claim 7, wherein the third conductive element and the second conductive element are interconnected. ### Claim 10 (depends on 1) The flexible interconnect circuit of claim 1, wherein the first dielectric comprises polyethylene terephthalate (PET). ### Claim 11 (depends on 2) The flexible interconnect circuit of claim 2, wherein the second dielectric further comprises polyethylene, operable as an adhesive layer. ### Claim 12 (depends on 6) The flexible interconnect circuit of claim 6, wherein the inner dielectric comprises polypropylene. ### Claim 13 (depends on 12) The flexible interconnect circuit of claim 12, wherein the inner dielectric further comprises polyethylene, operable as an adhesive layer. ### Claim 14 (depends on 13) The flexible interconnect circuit of claim 13, wherein the second dielectric further comprises polypropylene and polyethylene such that the polyethylene of the second dielectric is bonded to the polyethylene of the inner dielectric. ### Claim 15 (depends on 1) The flexible interconnect circuit of claim 1, further comprising a fourth conductive element and a fifth conductive element, wherein: the fourth conductive element is offset relative to the first conductive element along the width of the flexible interconnect circuit and has a same thickness as the first conductive element, the fifth conductive element is offset relative to the second conductive element along the width of the flexible interconnect circuit and has a same thickness as the second conductive element, the fifth conductive element is disposed between the first dielectric and the second dielectric and stacked with the fourth conductive element along the thickness of the flexible interconnect circuit, and the fourth conductive element is positioned between the first dielectric and the fifth conductive element. ### Claim 16 (depends on 15) The flexible interconnect circuit of claim 15, wherein: the second conductive element is operable as a power conductor, and the fifth conductive element is operable as a signal line. ### Claim 17 (depends on 16) The flexible interconnect circuit of claim 16, wherein the second conductive element and the fifth conductive element have different widths. ### Claim 18 An assembly comprising: a vehicle body panel; and a flexible interconnect circuit comprising a first dielectric, a second dielectric, a first conductive element, and a second conductive element, and having a length, a width, a thickness, and an aspect ratio defined as a ratio of the width to the thickness, wherein: the second dielectric is adhered to and thermally coupled to the vehicle body panel, the first conductive element is disposed between the first dielectric and the second dielectric, the second conductive element is disposed between the first dielectric and the second dielectric and stacked with the first conductive element along the thickness of the flexible interconnect circuit, the first conductive element is positioned between the first dielectric and the second conductive element, the second conductive element is positioned between the second dielectric and the first conductive element, the second conductive element comprises aluminum and has a thickness between about 10 micrometers and 1000 micrometers, the first dielectric and the second dielectric conform around a stack comprising at least the first conductive element and the second conductive element, the first dielectric and the second dielectric form edge portions around the stack such that the stack is positioned between the edge portions along the width of the flexible interconnect circuit, and the first dielectric and the second dielectric are directly bonded to each other in the edge portions.