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US 12,764,400 B2Granted
Heat radiation structure
AssigneeFUJIFILM Corporation
InventorsTakayuki Shimizu, Masaaki Takagi
Life of this patent
Estimating the term…
Abstract
The heat radiation structure includes an imaging element, a laminate that is disposed in a Z1 direction, which is a direction toward a side opposite to an imaging surface, with respect to the imaging element, a sheet metal member that includes a through-hole, a rear case that is disposed on a Z1 direction side with respect to the sheet metal member, and a first heat conduction member that comes into contact with the laminate and that comes into contact with the rear case through the through-hole. The laminate is a heat source member.
Claims19
A heat radiation structure comprising:
- an imaging element;
- a heat source member that is disposed in a first direction of the imaging element;
- a first metal member that includes a through-hole;
- a second metal member that is disposed on a first direction side with respect to the first metal member;
- and
- a first heat conduction member that comes into contact with the heat source member and that comes into contact with the second metal member through the through-hole,
- wherein the first heat conduction member comes into contact with the first metal member with a change in shape,
- an area of the second metal member is larger than an area of the first metal member as viewed in a direction parallel to the first direction, and a volume of the second metal member is larger than a volume of the first metal member, and
- a first thermal conductivity, which is a thermal conductivity of the first metal member, is larger than a second thermal conductivity, which is a thermal conductivity of the second metal member.
6 more elements
Dependencies are inferred from the claim text.