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US 12,763,747 B2Granted
Multilayer common mode filter
AssigneeAmotech Co., Ltd.
InventorsByungguk Lim, Kyuhwan Park, Heehwang Kim, Tonggi Kim
Life of this patent
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Abstract
A multilayer common mode filter of the present disclosure is a filter comprising a plurality of coils configuring mutually different channels, wherein a plurality of coil patterns, and a plurality of via conductors connecting the coil patterns are provided inside a coil stack, and the plurality of via conductors are arranged, on a floor plan of the coil stack, in positions where same do not overlap with each other.
Claims19
A multilayer common mode filter comprising:
- a first stack provided with a first coil pattern, a second coil pattern, and a third coil pattern;
- and
- a second stack provided with a fourth coil pattern, a fifth coil pattern, and a sixth coil pattern, and disposed under the first stack to form a coil stack along with the first stack,
- wherein the coil stack comprises:
- a first via conductor connected to the first coil pattern in the first stack;
- a second via conductor connected to the sixth coil pattern in the second stack;
- a third via conductor connected to the second coil pattern and the third coil pattern in the first stack;
- and
- a fourth via conductor connected to the fourth coil pattern and the fifth coil pattern in the second stack,
- wherein in a top view of the coil stack, the fourth via conductor is disposed at a position that does not overlap the first via conductor, the second via conductor, and the third via conductor,
- wherein in a vertical sectional view of the coil stack,
- the first via conductor is spaced apart from the second via conductor,
- the third via conductor and the fourth via conductor are spaced apart from each other between the first via conductor and the second via conductor, and
- the third via conductor is interposed between the first via conductor and the fourth via conductor.
11 more elements
A multilayer common mode filter comprising:
- a first stack provided with a first coil pattern, a second coil pattern, and a third coil pattern;
- and
- a second stack provided with a fourth coil pattern, a fifth coil pattern, and a sixth coil pattern, and disposed under the first stack to form a coil stack along with the first stack,
- wherein the coil stack comprises:
- a first via conductor connected to the first coil pattern in the first stack;
- a second via conductor connected to the sixth coil pattern in the second stack;
- a third via conductor connected to the second coil pattern and the third coil pattern in the first stack;
- and
- a fourth via conductor connected to the fourth coil pattern and the fifth coil pattern in the second stack,
- wherein in a top view of the coil stack, the fourth via conductor is disposed at a position that does not overlap the first via conductor, the second via conductor, and the third via conductor,
- wherein in a vertical sectional view of the coil stack,
- the third via conductor is spaced apart from the fourth via conductor,
- the first via conductor and the second via conductor are spaced apart from each other between the third via conductor and the fourth via conductor, and
- the first via conductor is interposed between the second via conductor and the third via conductor.
11 more elements
A multilayer common mode filter comprising:
- a first stack provided with a first coil pattern, a second coil pattern, and a third coil pattern;
- and
- a second stack provided with a fourth coil pattern, a fifth coil pattern, and a sixth coil pattern, and disposed under the first stack to form a coil stack along with the first stack,
- wherein the coil stack comprises:
- a first via conductor connected to the first coil pattern in the first stack;
- a second via conductor connected to the sixth coil pattern in the second stack;
- a third via conductor connected to the second coil pattern and the third coil pattern in the first stack;
- and
- a fourth via conductor connected to the fourth coil pattern and the fifth coil pattern in the second stack,
- wherein in a top view of the coil stack, the fourth via conductor is disposed at a position that does not overlap the first via conductor, the second via conductor, and the third via conductor,
- wherein in a vertical sectional view of the coil stack,
- the third via conductor is spaced apart from the fourth via conductor,
- the first via conductor and the second via conductor are interposed between the third via conductor and the fourth via conductor, and are disposed to overlap in the top view of the coil stack.
10 more elements
Dependencies are inferred from the claim text.