Multiple-stage multiple-path power amplifier with in-package amplifier dies and external inter-stage power splitter

A multiple-stage multiple-path power amplifier comprising:

• an amplifier substrate having a top substrate surface and first, second, and third device interconnects at the top substrate surface;
• a packaged semiconductor device coupled to the top substrate surface, wherein the packaged semiconductor device includes
• a device substrate with a mounting surface and a bottom surface,
• an interface for signal communication with a power splitter, wherein the interface includes first, second, and third leads coupled to the device substrate and coupled to the first, second, and third device interconnects, respectively,
• a first stage of a multiple-stage amplifier that includes a first amplifier die with a first input, a first output, and a first power transistor that functions as a driver amplifier, wherein the first output is coupled to the first lead, and
• a second stage of a multiple-stage amplifier that includes
• a first amplifier path with a second amplifier die that has a second input, a second output, and a second transistor that functions as a first final stage amplifier, wherein the second input is coupled to the second lead, and
• a second amplifier path with a third amplifier die that has a third input, a third output, and a third transistor that functions as a second final stage amplifier, wherein the third input is coupled to the third lead;
• and
• the power splitter coupled to the top substrate surface, wherein the power splitter has a splitter input coupled to the first device interconnect, a first splitter output coupled to the second device interconnect, and a second splitter output coupled to the third device interconnect, and wherein the power splitter is configured to receive a first signal characterized by a first signal power at the splitter input, to provide a first portion of the first signal power at the first splitter output, and to provide a second portion of the first signal power at the second splitter output.