# US 12,763,453 B2 · Electronic device having antenna module

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- Number: US 12,763,453 B2
- Document ID: US12763453B2
- Status: Granted
- Kind: B2
- Application number: 19/129,624
- Filed: 2022-12-16
- Published: 2026-01-08
- Granted: 2026-10-13
- Earliest claimed: 2022-12-16
- Assignees: LG Electronics Inc.
- Applicants: LG Electronics Inc.
- Inventors: Seungmin Woo; Yusuhk Suh; Dongik Lee
- Web page: https://patentgrep.com/patent/US12763453B2

## CPC

- H01Q 1/22: by structural association with other equipment or articles
- H01Q 9/0414: {in a stacked or folded configuration}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

This electronic device comprises: a metal frame; a dielectric case formed at one side of the metal frame; an air material included in the dielectric case; and an array antenna disposed in an inner region of the dielectric case, and formed in a substrate. The dielectric case includes: a first side part attached to the metal frame; a second side part corresponding to the first side part; and a third side part and a fourth side part formed between the first side part and the second side part. The side parts of the dielectric case include inner surfaces and outer surfaces corresponding to the inner surfaces. The inner surfaces include: a first inner surface spaced a first gap from a surface that is vertical to the longitudinal end of the array antenna; and a second inner surface spaced a second gap from the surface.

## Claims

### Claim 1

An electronic device comprising:
a metal frame coupled to a side region of the electronic device;
a dielectric case arranged at one side of the metal frame, wherein the dielectric case is shaped to include an inner region;
a first array antenna and a second array antenna, each arranged in respective substrates and located in the inner region of the dielectric case,
wherein the dielectric case comprises a first side part coupled to the metal frame, a second side part corresponding to the first side part, and a third side part and a fourth side part each being arranged between the first side part and the second side part,
the third side part comprises a first inner surface, a second inner surface, and a first outer surface, and the fourth side part comprises a first inner surface, a second inner surface, and a second outer surface,
for the third side part, the first inner surface faces and is spaced apart, by a first gap, from a surface vertical to a longitudinal end of the first array antenna and the second inner surface faces and is spaced apart, by a second gap, from the surface vertical to the longitudinal end of the first array antenna,
for the fourth side part, the first inner surface faces and is spaced apart, by the first gap, from the surface vertical to a longitudinal end of the second array antenna and the second inner surface faces and is spaced apart, by the second gap, from the surface vertical to the longitudinal end of the second array antenna,
the second gap is wider than the first gap,
for each of the third side part and the fourth side part, a first thickness between the first inner surface and a respective one of the first outer surface and the second outer surface is greater than a second thickness between the second inner surface and a respective one of the first outer surface and the second outer surface,
the first array antenna is configured to radiate a wireless signal through the first inner surface and the second inner surface of the third side part and the first outer surface of the third side part, and
the second array antenna is configured to radiate a wireless signal through the first inner surface and the second inner surface of the fourth side part and the second outer surface of the fourth side part.

### Claim 2 (depends on 1)

The electronic device of claim 1, wherein
each of the first array antenna and the second array antenna is spaced apart from an inner surface of the first side part by a third gap,
each of the first array antenna and the second array antenna is spaced apart from an inner surface of the second side part by a fourth gap, and
the third gap is wider than the fourth gap.

### Claim 3 (depends on 1)

The electronic device of claim 1, wherein for each of the first array antenna and the second array antenna, a respective connecting portion is electrically connected to the metal frame and is further arranged in a ground region located inside a respective one of the substrates.

### Claim 4 (depends on 3)

The electronic device of claim 3, wherein the respective substrates of the first array antenna and the second array antenna are each configured as a multi-layered substrate,
antenna elements of the first array antenna and the second array antenna are arranged on a particular layer of a respective one of the multi-layered substrates, and
the antenna elements of the first array antenna and the second array antenna are configured to respectively radiate the wireless signal as respective beamformed wireless signals.

### Claim 5 (depends on 4)

The electronic device of claim 4, wherein the antenna elements of the first array antenna and the second array antenna comprise, on the particular layer of the respective one of the multi-layered substrates, a 1×N array antenna in which antenna elements are arranged to be apart from each other in one axial direction by a predetermined gap, and
the antenna elements of the 1×N array antenna are end-fire radiators that radiate the wireless signals through one side surface of the respective one of the multi-layered substrates.

### Claim 6 (depends on 5)

The electronic device of claim 5, wherein for each of the first array antenna and the second array antenna, the 1×N array antenna is configured to:
generate a first radiation pattern having a first beam width in the one axial direction; and
generate a second radiation pattern having a second beam width within a predetermined angle in a lower direction of the metal frame, and
the second beam width is greater than the first beam width.

### Claim 7 (depends on 4)

The electronic device of claim 4, wherein for each of the first array antenna and the second array antenna, the multi-layered substrate is arranged to be spaced apart from the first inner surface which is at a lower region of the dielectric case,
the first array antenna and the second array antenna is configured to radiate the wireless signal in a frequency band between 57 GHz and 70 GHz, and
for each of the third side part and the fourth side part, a height from the particular layer of the multi-layered substrate on which the antenna elements, for each of the first array antenna and the second array antenna, are positioned relative to an upper end of the first inner surface is has a value in a range of 0.08λ0 to 0.9λ0.

### Claim 8 (depends on 7)

The electronic device of claim 7, wherein for each of the third side part and the fourth side part, a second height for which air is to be received from the upper end of the first inner surface to an upper end of the second inner surface has a value of 0.04λ0 or greater, and
a distance between the first inner surface of the dielectric case and the multi-layered substrate has a value of 0.6λ0 or less.

### Claim 9 (depends on 7)

The electronic device of claim 7, wherein for each of the first array antenna and the second array antenna, the respective connecting portion is implemented as a metal case arranged on an upper portion of the multi-layered substrate,
the antenna elements of the first array antenna and the second array antenna are arranged in respective first regions corresponding to a radiator region of the multi-layered substrate,
for each of the first array antenna and the second array antenna, the metal case is arranged in a second region corresponding to the ground region of the multi-layered substrate, and
for each of the first array antenna and the second array antenna, a distance gc from a position in which the antenna elements are arranged to one side end of the metal case is (n+0.1)*λ0<gc<(n+0.7)*λ0, and n is 0 or a natural number.
