Nanoscale failure analysis method
AssigneeShanghai Huali Microelectronics Corporation
InventorsYunong Sun, Cheng Wu, Shuqing Duan, Jinde Gao
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AssigneeShanghai Huali Microelectronics Corporation
InventorsYunong Sun, Cheng Wu, Shuqing Duan, Jinde Gao
Estimating the term…
This application discloses a nanoscale failure analysis method, including step 1: placing a first sample to be analyzed on a sample stage of an FIB machine, and performing cutting on a selected area of the first sample by using an ion beam in the FIB machine to form a first cross section and expose a metal pattern on the first cross section; step 2: depositing a protective layer on the first cross section by using an electron beam of the FIB machine; step 3: transferring the first sample to a nano prober, the protective layer being used for protecting the metal pattern and preventing metal diffusion in a transfer process; step 4: performing surface micro treatment on the first sample by using an ion source in the nano prober to remove the protective layer; step 5: performing probing on the metal pattern and implementing electrical testing through the nano prober.
A nanoscale failure analysis method, comprising:
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