Integrated passive devices with enhanced form factor

An integrated passive device comprising:

• a first capacitor including a conductive substrate having a front side and a back side, a front dielectric layer on the front side of the conductive substrate, a back dielectric layer on the back side of the conductive substrate, a front conductive polymer layer on the front dielectric layer, and a back conductive polymer layer on the back dielectric layer;
• a second capacitor stacked on the first capacitor, the second capacitor including a conductive substrate having a front side and a back side, a front dielectric layer on the front side of the conductive substrate, a back dielectric layer on the back side of the conductive substrate, a front conductive polymer layer on the front dielectric layer, and a back conductive polymer layer on the back dielectric layer;
• a first metal contact electrically connected to one or both of the conductive substrates of the first and second capacitors;
• a second metal contact electrically isolated from the first metal contact and electrically connected to the front and back conductive polymer layers of the first and second capacitors;
• a passthrough electrical connection between a front outer surface of the integrated passive device and a back outer surface of the integrated passive device opposite the front outer surface;
• and
• a first metallization layer arranged to promote electrical conductivity between the front conductive polymer layer of the first capacitor and the second metal contact and to promote electrical conductivity between the back conductive polymer layer of the second capacitor and the second metal contact, the first and second capacitors being bonded together by the first metallization layer;
• wherein each of the first and second capacitors further includes a sidewall dielectric layer on a sidewall of the conductive substrate, the sidewall dielectric layer connecting the front and back dielectric layers;
• wherein the integrated passive device further comprises a termination pad that extends along the sidewall dielectric layers of the first and second capacitors, the second metal contact being electrically connected to the first metallization layer by way of the termination pad;
• wherein the integrated passive device further comprises an additional passthrough electrical connection between the front outer surface of the integrated passive device and the back outer surface of the integrated passive device opposite the front outer surface, the additional passthrough electrical connection comprising a first blind via extending from the front outer surface to the termination pad and a second blind via extending from the back outer surface to the termination pad.

An integrated passive device comprising:

• a first capacitor including a conductive substrate, a dielectric layer on the conductive substrate, and a conductive polymer layer on the dielectric;
• a second capacitor stacked on the first capacitor, the second capacitor including a conductive substrate, a dielectric layer on the conductive substrate, and a conductive polymer layer on the dielectric;
• a first metal contact electrically connected to one or both of the conductive substrates of the first and second capacitors;
• a second metal contact electrically isolated from the first metal contact and electrically connected to the conductive polymer layers of the first and second capacitors;
• and
• a passthrough electrical connection between a front outer surface of the integrated passive device and a back outer surface of the integrated passive device opposite the front outer surface;
• wherein the first and second capacitors are bonded together by a conductive foil provided therebetween, and the passthrough electrical connection comprises a first blind via extending from the front outer surface to a front side of the conductive foil and a second blind via extending from the back outer surface to a back side of the conductive foil.