Electronic component and method for producing electronic component

An electronic component comprising:

• an element body including a stack and a side margin, the stack having a rectangular or substantially rectangular parallelepiped shape and including main surfaces opposing each other in a thickness direction, side surfaces opposing each other in a width direction orthogonal or substantially orthogonal to the thickness direction, and end surfaces opposing each other in a length direction orthogonal or substantially orthogonal to the thickness direction and the width direction, the stack including internal electrode layers and a dielectric layer stacked in the thickness direction, the side margin covering each of side surfaces of the stack in the width direction;
• and
• an external electrode covering one of the end surfaces of the element body in the length direction and electrically connected to at least one of the internal electrode layers;
• wherein
• the stack includes a first portion located at an end in the width direction of the stack in a portion sandwiched between the internal electrode layers in the thickness direction, and a second portion located at a center in the width direction of the stack in the portion sandwiched between the internal electrode layers in the thickness direction;
• each of the first portion and the second portion extends from one of the internal electrode layers that is closest to one of the main surfaces in the thickness direction to another of the internal electrode layers that is closest to another of the main surfaces in the thickness direction;
• and
• an average particle size of dielectric grains included in the first portion is larger than an average particle size of dielectric grains included in the second portion.