Ceramic electronic device provided with multilayer chip having internal electrode layers an external electrodes both containing sub metal element and manufacturing method of the same

A ceramic electronic device comprising:

• a multilayer chip in which each of a plurality of dielectric layers of which a main component is a ceramic and each of a plurality of internal electrode layers including Ni as a main component are alternately stacked, the multilayer chip having a rectangular parallelepiped shape, each of the plurality of internal electrode layers being exposed to two end faces opposite to each other;
• and
• external electrodes that are respectively provided on the two end faces and have a main component of Ni and a sub metal element other than Ni,
• wherein all the plurality of internal electrode layers include the sub metal element other than Ni, and co-materials,
• wherein a concentration of the sub metal element in the plurality of internal electrode layers is higher than a concentration of the sub metal element in the external electrodes which is more than zero,
• wherein the sub metal element is a metal element exclusive of Pt,
• wherein the concentration of the sub metal element in the plurality of internal electrode layers is more than 0.1 at % and 5.0 at % or less with respect to Ni, and
• wherein a ratio of the concentration of the sub metal element in the external electrodes to the concentration of the sub metal element in the plurality of internal electrode layers is 0.1 or more and 0.5 or less.