Hidden defect detection and EPE estimation based on the extracted 3D information from e-beam images
AssigneeASML Netherlands B. V.
InventorsMaxim Pisarenco, Scott Anderson Middlebrooks, Markus Gerardus Martinus Maria Van Kraaij, Adrianus Cornelis Matheus Koopman
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Abstract
A method for determining the existence of a defect in a printed pattern may include obtaining a) a captured image of a printed pattern from an image capture device, and b) a simulated image of the printed pattern generated by a process model. The method may include generating a combined image as a weighted combination of portions of the captured image and the simulated image. The method may include determining whether a defect exists in the printed pattern based on the combined image.
Claims15
A method for determining an existence of a defect in a printed pattern, the method comprising:
- obtaining a) a captured image of a printed pattern on a semiconductor substrate from an image capture device, and b) a simulated image of the printed pattern generated by a semiconductor patterning process model;
- generating a combined image as a weighted combination of portions of the captured image and the simulated image, wherein the weighted combination is based on a) a noise level or artifact in the captured image and/or b) an error level in the simulated image;
- and
- determining whether a semiconductor patterning defect exists in the printed pattern based on the combined image.
A method for improving a semiconductor patterning process model for a patterning process, the method comprising:
- obtaining a) a captured image of a printed pattern on a semiconductor substrate from an image capture device, b) a simulated image of the printed pattern generated by the semiconductor patterning process model, and c) a combined image of the captured image and the simulated image;
- determining three-dimensional features of the printed pattern from the combined image;
- and
- improving the semiconductor patterning process model based on the determined three-dimensional features.
A computer program product comprising a non-transitory computer readable medium having instructions recorded thereon, the instructions when executed by a computer implementing a method comprising:
- obtaining a) a captured image of a printed pattern on a semiconductor substrate from an image capture device, and b) a simulated image of the printed pattern generated by a semiconductor patterning process model;
- generating a combined image as a weighted combination of portions of the captured image and the simulated image, wherein the weighted combination is based on a) a noise level in the captured image and/or b) an error level in the simulated image;
- and
- determining whether a semiconductor patterning defect exists in the printed pattern based on the combined image.
A computer program product comprising a non-transitory computer readable medium having instructions recorded thereon, the instructions when executed by a computer implementing a method comprising:
- obtaining a) a captured image of a printed pattern on a semiconductor substrate from an image capture device, b) a simulated image of the printed pattern generated by a semiconductor patterning process model, and c) a combined image of the captured image and the simulated image;
- determining three-dimensional features of the printed pattern from the combined image;
- and
- improving the semiconductor patterning process model based on the determined three-dimensional features.
Dependencies are inferred from the claim text.