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US 12,762,292 B2Granted
Security on die-to-die interconnect
AssigneeAltera Corporation
InventorsLai Guan Tang, Ankireddy Nalamalpu, Mahesh K. Kumashikar, Atul Maheshwari
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Abstract
Systems or methods of the present disclosure may provide a semiconductor device including a die of a multi-die package including encryption circuitry to receive data and to encrypt the data to generate encrypted data; and a connection interface to transmit the encrypted data over a die-to-die interconnect to a second die.
Claims20
A semiconductor device comprising:
- a multi-die package comprising:
- a first die comprising:
- first encryption circuitry to receive data and to encrypt the data to generate encrypted data;
- and
- a first connection interface to transmit the encrypted data over a die-to-die interconnect;
- the die-to-die interconnect;
- and
- a second die comprising:
- a second connection interface to receive the encrypted data from the first die via the die-to-die interconnect;
- and
- second encryption circuitry to receive the encrypted data and to decrypt the encrypted data to generate decrypted data.
8 more elements
A semiconductor device comprising:
- a die of a multi-die package comprising:
- encryption circuitry to receive data and to encrypt the data to generate encrypted data;
- and
- a connection interface to transmit the encrypted data over a die-to-die interconnect to a second die within the multi-die package.
1 more element
A semiconductor device comprising:
- a die of a multi-die package comprising:
- a connection interface to receive encrypted data from a second die of the multi-die package via a die-to-die interconnect, wherein the encrypted data is encrypted on the second die in the multi-die package;
- decryption circuitry to receive the encrypted data and to decrypt the encrypted data to generate decrypted data;
- and
- data utilization circuitry to utilize the decrypted data.
2 more elements
Dependencies are inferred from the claim text.