HBM base die with 2.5D and 3D PHY interface
AssigneeMicron Technology, Inc.
InventorsSujeet Ayyapureddi, Lingming Yang, Raymond Wei-tang Chang, Raghukiran Sreeramaneni, Dong Uk Lee, Nevil N. Gajera
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Abstract
Systems and methods are provided for using a 2.5D PHY and a 3D PHY for communications between a memory device and a host device. The memory device includes a 2.5D PHY for communications with the host device through a predefined communication interface and a 3D PHY for communications with the host device through a customized communication interface. The 2.5D PHY of the memory device is used for communications through the predefined communication interface when the customized communication interface is not available or undesired (e.g., during testing of the memory device).
Claims21
An apparatus, comprising:
- one or more memory dies;
- and
- an interface die comprising:
- a 2.5D PHY communicatively coupled to the one or more memory dies via Through-Wafer Interconnects (TWIs), wherein the 2.5D PHY is configured to communicate with a host device via a predefined communication interface;
- and
- a 3D PHY communicatively coupled to the one or more memory dies via the TWIs, wherein the 3D PHY is configured to communicate with the host device via a customized communication interface corresponding to a customized arrangement of one or more circuits.
An interface die of a memory device, comprising:
- a 2.5D PHY communicatively coupled to one or more dies of the memory device via Through-Wafer Interconnects (TWIs), wherein the 2.5D PHY is configured to communicate with a host device via a predefined communication interface;
- and
- a 3D PHY communicatively coupled to the one or more dies via the TWIs, wherein the 3D PHY is configured to communicate with the host device via a customized communication interface corresponding to a customized arrangement of one or more circuits.
Interface circuitry of a memory device, comprising:
- a 2.5D PHY configured to communicate with a host device via a predefined communication interface;
- and
- a 3D PHY configured to communicate with the host device via a customized communication interface corresponding to a customized arrangement of one or more circuits.
Dependencies are inferred from the claim text.