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US 12,761,432 B2Granted
Optical coupling adapter for fiber-to-chip integration
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTung-Liang Shao, Yu-Sheng Huang, Chen-Hua Yu
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Abstract
A method includes forming an optical engine including a photonic integrated circuit die, wherein the photonic integrated circuit die includes an optical component, forming an adapter comprising a laser written waveguide, and assembling the optical engine, the adapter, and an optical fiber as a package. The optical fiber is optically coupled to the optical component through the laser written waveguide in the adapter.
Claims20
A method comprising:
- forming an optical engine comprising a photonic integrated circuit die, wherein the photonic integrated circuit die comprises an optical component;
- forming an adapter comprising:
- a laser written waveguide;
- and
- a laser written lens joined to the laser written waveguide;
- and
- assembling the optical engine, the adapter, and an optical fiber as a package, wherein the laser written lens is between the laser written waveguide and the optical fiber, wherein the optical fiber is optically coupled to the optical component through the laser written waveguide in the adapter.
4 more elements
A package comprising:
- an optical engine comprising a photonic integrated circuit die, wherein the photonic integrated circuit die further comprises an optical component;
- an adapter comprising:
- a laser written waveguide, wherein a first end of the laser written waveguide is optically coupled to the optical component;
- and
- a lens joined to the laser written waveguide;
- and
- an optical fiber aligned to a second end of the laser written waveguide, wherein the laser written lens is between the laser written waveguide and the optical fiber.
4 more elements
A package comprising:
- a package substrate;
- an interposer over and bonding to the package substrate;
- an optical engine over and bonding to the interposer;
- an adapter attached to the interposer, wherein the adapter comprises a laser written waveguide;
- an optical fiber attached to the package substrate, wherein the optical fiber is optically coupled to the optical engine through the laser written waveguide and the interposer;
- and
- an optical glue between the adapter and the optical engine, wherein the optical glue is configured to allow optical signals to be transferred between the optical engine and the adapter through the optical glue.
4 more elements
Dependencies are inferred from the claim text.