# US 12,761,430 B2 · Package structure having photonic integrated circuit

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- Number: US 12,761,430 B2
- Document ID: US12761430B2
- Status: Granted
- Kind: B2
- Application number: 18/636,312
- Filed: 2024-04-16
- Published: 2024-08-01
- Granted: 2026-10-13
- Earliest claimed: 2020-08-11
- Assignees: Molex Incorporated
- Applicants: Molex, LLC
- Inventors: Chih-Chung Hsu; Chih-Chung Wu; Zuon-Min Chuang; Chih-Wei Peng
- Web page: https://patentgrep.com/patent/US12761430B2

## CPC

- G02B 6/4245: {Mounting of the opto-electronic elements}
- G02B 6/12004: {Combinations of two or more optical elements}
- G02B 6/4204: {the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208)}
- G02B 6/424: {Mounting of the optical light guide}
- G02B 6/4244: {Mounting of the optical elements}
- G02B 6/428: {containing printed circuit boards [PCB]}
- G02B 2006/12102: {Lens}
- G02B 6/30: for use between fibre and thin-film device
- G02B 6/4206: {Optical features (G02B6/4207, G02B6/421 take precedence)}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

## Claims

### Claim 1

A package structure, comprising:
a substrate having a recessed portion;
an optical waveguide connection assembly separate from the substrate, the optical waveguide connection assembly suspended over, and extending into, the recessed portion; and
a chip having an optical waveguide structure, the chip connected with the optical waveguide connection assembly via the optical waveguide structure,
wherein the optical waveguide connection assembly is configured to couple an optical fiber to the optical waveguide structure.

### Claim 2 (depends on 1)

The package structure of claim 1, wherein:
the chip has a first optical module recessed portion,
the optical waveguide structure is adjacent to the first optical module recessed portion,
the chip is engaged to the substrate by flip chip, and
the package structure further comprises an optical module disposed in the first optical module recessed portion of the chip.

### Claim 3 (depends on 2)

The package structure of claim 2, wherein:
the optical module comprises a light source and a lens, and
the light source is configured to generate a light that passes through the lens and is emitted to the optical waveguide structure.

### Claim 4 (depends on 3)

The package structure of claim 3, wherein an optical path of the light generated by the light source is located on a plane that is substantially parallel to the substrate, and a first electrical signal path of the optical module is different from a second electrical signal path of the chip.

### Claim 5 (depends on 4)

The package structure of claim 4, wherein the light generated by the light source is incident to the optical waveguide structure along the optical path of an L shape via the lens.

### Claim 6 (depends on 2)

The package structure of claim 2, wherein the substrate has a second optical module recessed portion, and the optical module extends into the second optical module recessed portion.

### Claim 7 (depends on 1)

The package structure of claim 1, wherein the chip is a flip-chip type photonic integrated circuit.

### Claim 8 (depends on 1)

The package structure of claim 1, wherein the optical waveguide connection assembly comprises a first section and a second section connected with the first section, the first section being disposed on a top surface of the chip, and the second section extending into the recessed portion along a side surface of the chip and separating from the substrate.

### Claim 9

An optical device, comprising:
a light source;
a lens; and
an optical waveguide connection assembly configured to be connected with a chip that is engaged to a substrate, the optical waveguide connection assembly separate from the substrate,
wherein the optical waveguide connection assembly is suspended over, and extends into, a recessed portion of the substrate, and
wherein the optical waveguide connection assembly is configured to couple an optical fiber to an optical waveguide structure of the chip.

### Claim 10 (depends on 9)

The optical device of claim 9, wherein the light source is configured to generate a light that passes through the lens and is emitted to the optical waveguide structure.

### Claim 11 (depends on 10)

The optical device of claim 10, wherein an optical path of the light generated by the light source is located on a plane that is substantially parallel to the substrate.

### Claim 12 (depends on 10)

The optical device of claim 10, wherein the light generated by the light source is incident to the optical waveguide structure along an optical path of an L shape via the lens.

### Claim 13 (depends on 12)

The optical device of claim 12, wherein the light is emitted to the optical fiber, the optical fiber connected with the chip.

### Claim 14 (depends on 13)

The optical device of claim 13, wherein the light source is electrically connected with the substrate via the chip, wherein the chip is engaged to the substrate by flip chip.