Optical packaging

A package structure comprising:

• a photonic die configured as an optical bridge;
• a first electronic die and a second electronic die, wherein the first electronic die includes an electronic device layer disposed between a frontside interconnect structure and a backside interconnect structure, wherein the backside interconnect structure is configured to deliver power to the electronic device layer;
• a package component, wherein the photonic die, the first electronic die, and the package component are stacked top-to-bottom, the backside interconnect structure of the first electronic die is connected to the package component, and the photonic die is connected to the first electronic die and the second electronic die;
• a thermally conductive and electrically isolative material disposed over the first electronic die and the second electronic die, wherein the thermally conductive and electrically isolative material is further disposed along sides of the photonic die;
• and
• a thermally conductive material disposed over the thermally conductive and electrically isolative material and the photonic die.

A method comprising:

• receiving a pair of photonic dies, wherein the pair of the photonic dies includes a first photonic die and a second photonic die;
• receiving an electronic die having a backside power delivery structure;
• attaching the first photonic die and the second photonic die of the pair of photonic dies to a frontside of the electronic die;
• attaching the backside power delivery structure of the electronic die to a package component, wherein the pair of the photonic dies, the electronic die, and the package component are stacked top-to-bottom and the electronic die is between the first photonic die and the package component and between the second photonic die and the package component;
• and
• forming a first thermal structure between the first photonic die and the second photonic die and a second thermal structure over the first thermal structure, wherein the first thermal structure includes a thermally conductive and electrically isolative material, the second thermal structure includes a thermally conductive material, and the second thermal structure overlaps the first photonic die and the second photonic die.