Ultrasonic inspection device, ultrasonic inspection method, and program
AssigneeHitachi Power Solutions Co., Ltd.
InventorsKaoru Sakai, Masayuki Kobayashi, Natsuki Sugaya, Koutaro Kikukawa
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AssigneeHitachi Power Solutions Co., Ltd.
InventorsKaoru Sakai, Masayuki Kobayashi, Natsuki Sugaya, Koutaro Kikukawa
Estimating the term…
Provided is an ultrasonic inspection device and method capable of generating a clear image of a desired bonding interface without an S-Gate. The controller in the ultrasonic inspection device is configured to: (A) define a first gate indicating a time range in which a part of a reflected wave is extracted based on a predetermined condition received; (B) define one or more second gates each indicating a time width smaller than that of the first gate before an end time of the first gate; (C) for each of a plurality of measurement points of an inspection object, (C1) detect a lower layer echo or a local peak, (C2) adjust a reception time of the reflected wave based on the lower layer echo or the local peak; and (D) generate a cross-sectional image of the inspection object based on the reflected wave.
An ultrasonic inspection device comprising:
An ultrasonic inspection method performed by an ultrasonic inspection device including:
One or more non-transitory computer readable storage media storing one or more sequences of instructions which, when executed using one or more processors of an ultrasonic inspection system, cause the one or more processors to execute:
Dependencies are inferred from the claim text.