Method for manufacturing an inductive conductivity sensor and inductive conductivity sensor

A method for manufacturing an inductive conductivity sensor, comprising:

• providing an electronics unit and an injection mold,
• wherein the electronics unit has a printed circuit board, a transmitter coil, a receiver coil, and a temperature sensor,
• wherein the printed circuit board extends along a first axis and has a first axial end and a second axial end,
• wherein the printed circuit board has a first board side and a second board side, a first through-hole, and a second through-hole,
• wherein the first through-hole is arranged between the first axial end and the second axial end of the printed circuit board, and the second through-hole is arranged between the first axial end and the first through-hole, so that a bracket is formed between the first axial end and the second through-hole,
• wherein the temperature sensor is arranged on the bracket, and
• wherein the transmitter coil is arranged on the first board side, and the receiver coil is arranged on the second board side, each around the first through-hole;
• fixing the electronics unit relative to the injection mold using a clamping unit, wherein the clamping unit clamps the printed circuit board at a clamping point;
• injecting a plastic material to form a housing of the inductive conductivity sensor;
• removing the clamping unit;
• and
• closing the housing at the clamping point.