High temperature piezo-resistive pressure sensor and packaging assembly therefor

A packaged pressure sensor assembly comprising:

• a pressure sensor including an upper substrate and a lower substrate bonded to one another by way of a first glass frit having a first bonding temperature, so as to define a hermetically sealed pressure sensing chamber therebetween;
• a pedestal substrate directly below the lower substrate of the pressure sensor and spanning a width of the pressure sensor, wherein a bottom surface of the lower substrate of the pressure sensor is directly bonded to the pedestal substrate by way of a secondary glass frit, wherein the lower substrate of the pressure sensor and the pedestal substrate are aligned such that a pressure port in the pedestal substrate is aligned with a cavity defined by the lower substrate;
• and
• a housing defining an internal cavity having a base with a support surface for supporting the pressure sensor, wherein the pressure sensor is bonded to the support surface of the base through the pedestal substrate by a second glass frit having a second bonding temperature that is lower than the first bonding temperature.