Pattern measurement device, pattern measurement program, and pattern measurement method
AssigneeHORIBA STEC, Co., Ltd.
InventorsSeiji Higuchi, Ryosuke Ogaki, Takayuki Ueda
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AssigneeHORIBA STEC, Co., Ltd.
InventorsSeiji Higuchi, Ryosuke Ogaki, Takayuki Ueda
Estimating the term…
The present invention is to accurately measure a dimension of a pattern by using statistical outlier processing, and is a pattern measurement device for measuring a dimension of a pattern formed on a sample. The pattern measurement device includes: a dimension measurement unit configured to measure a dimension of the pattern; an outlier removal unit configured to execute outlier processing at least twice on a plurality of dimension values measured by the dimension measurement unit; and a representative value determination unit configured to obtain a representative dimension value of the pattern from one or a plurality of the dimension values from which an outlier has been removed by the outlier removal unit.
A pattern measurement device for measuring a dimension of a pattern formed on a sample, the pattern measurement device comprising a processor configured to:
A non-transitory storage medium storing a pattern measurement program for measuring a dimension of a pattern formed on a sample, the pattern measurement program executable by a computer to:
A pattern measurement method for measuring a dimension of a pattern formed on a sample, the pattern measurement method comprising:
Dependencies are inferred from the claim text.