Decoupled floor underlayment

A decoupled floor underlayment, the floor underlayment with multiple-layer composite structures comprising a wiring layer, and an adhesive layer disposed on a bottom of the wiring layer, the wiring layer comprising a body of the wiring layer, and a plurality of protrusion portions disposed on the body of the wiring layer, the protrusion portions comprising first protrusion portions, and second protrusion portions with different structures from the first protrusion portions, wherein the first protrusion portions and the second protrusion portions are arranged in an array, the first protrusion portions arranged into a plurality of parallel rows;

• the second protrusion portions arranged into a plurality of parallel rows;
• the rows of the first protrusion portions and the rows of the second protrusion portions are alternately arranged;
• and in each column, the first protrusion portions and the second protrusion portions are alternately arranged;
• wherein the first protrusion portion comprises a first boss disposed on the body of the wiring layer, and two C-shaped structures symmetrically disposed on two sides of the first boss, each C-shaped structure of the first protrusion portion includes an inner arcuate surface facing toward the first boss;
• and an outer arcuate surfaces facing outwardly, and the outer arcuate surface forming an arcuate recess in a middle position;
• and wherein the second protrusion portion comprises a second boss disposed on the body of the wiring layer, and two C-shaped structures symmetrically disposed on two sides of the second boss, each C-shaped structure of the second protrusion portion includes an inner arcuate surface facing toward the second boss;
• and an outer arcuate surfaces facing outwardly.

A decoupled floor underlayment, comprising a wiring layer, and an adhesive layer disposed on a bottom of the wiring layer, the wiring layer comprising a body of the wiring layer, and a plurality of protrusion portions disposed on the body of the wiring layer, the protrusion portions comprising first protrusion portions and a second protrusion portions, wherein the first protrusion portions and the second protrusion portions are arranged in an array, each of the first protrusion portions forms a first ring-shaped concave with a smaller top and a larger bottom;

• and each of the second protrusion portions forms a second ring-shaped concave with a smaller top and a larger bottom;
• wherein the first protrusion portion comprises a first boss disposed on the body of the wiring layer, and two C-shaped structures symmetrically disposed on two sides of the first boss, each C-shaped structure of the first protrusion portion includes an inner arcuate surface facing toward the first boss;
• and an outer arcuate surfaces facing outwardly, and the outer arcuate surface forming an arcuate recess in a middle position;
• and wherein the second protrusion portion comprises a second boss disposed on the body of the wiring layer, and two C-shaped structures symmetrically disposed on two sides of the second boss, each C-shaped structure of the second protrusion portion includes an inner arcuate surface facing toward the second boss;
• and an outer arcuate surfaces facing outwardly, the first ring-shaped concave is bounded by the first boss and the two C-shaped structures symmetrically disposed on two sides of the first boss;
• the second ring-shaped concave is bounded by the second boss and the two C-shaped structures symmetrically disposed on two sides of the second boss.