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US 12,760,475 B2Granted
Floor pavement structure with passive temperature control
AssigneeApt Asia Pacific Pty. Ltd.
InventorsJames Michael Tritt, Robert Corbo, Sumeet Luddu
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Abstract
A floor pavement structure exhibiting resistance to overheating, the floor pavement structure comprising at least one heat conductive sub-layer including graphite, graphene or combinations thereof, the heat conductive sub-layer being disposed between a top layer and a substrate. The top layer may include a phase change material.
Claims16
A floor pavement structure comprising:
- a top layer comprising a PCM layer,
- a plurality of sub-layers comprising at least one heat conductive sub-layer comprising a heat conductive material,
- wherein the plurality of sub-layers are disposed between the top layer and a substrate,
- wherein the PCM layer comprises at least one PCM layer comprising a first and a second PCM layers, the second PCM layer being disposed on the first PCM layer;
- wherein the first PCM layer comprises at least one first PCM, and the second PCM layer comprises at least one second PCM,
- wherein the at least one first and second PCMs are dispersed within first and second acrylic materials, respectively,
- wherein the heat conductive material is dispersed within a polyurethane (PU) or an acrylic resin material, and
- wherein the heat conductive material comprises graphite, graphene, or a combination thereof.
5 more elements
A method of constructing a floor pavement structure, the method comprising:
- applying a first reaction mixture comprising a heat conductive material dispersed therein on top of a substrate and letting the applied reaction mixture to form a heat conductive sub-layer;
- and
- after the formation of the heat conductive sub-layer forming a top layer over the heat conductive sub-layer,
- wherein the heat conductive material comprises graphite, graphene or a combination thereof,
- wherein the forming of the top layer includes forming a PCM layer comprising a first PCM layer containing at least one first PCM over the heat conductive sub-layer, and after the formation of the first PCM layer forming a second PCM layer containing at least one second PCM over the first PCM layer,
- wherein the first reaction mixture is a PU reaction mixture and the heat conductive sub-layer is a primer or a filler layer;
- wherein the forming of the first PCM layer includes applying a first acrylic emulsion containing the at least one first PCM and letting the applied first acrylic emulsion to form the first PCM layer over the primer layer;
- wherein the forming of the second PCM layer includes applying a second acrylic emulsion containing the at least one second PCM and letting the applied second acrylic emulsion to form the second PCM layer over the first PCM layer,
- wherein the at least one first and second PCMs are the same or different and have a melting point from a melting point from 15° C. to 45° C., and the amount of the PCM in the first PCM layer is at least 5.0% less than the amount of the PCM in the second PCM layer.
6 more elements
Dependencies are inferred from the claim text.