n-type GaN crystal, GaN wafer, and GaN crystal, GaN wafer and nitride semiconductor device production method
AssigneeMitsubishi Chemical Corporation
InventorsKenji Iso, Tatsuya Takahashi, Tae Mochizuki, Yuuki Enatsu
Life of this patent
Estimating the term…
Abstract
Provided is an n-type GaN crystal, which has two main surfaces facing opposite directions from each other. One of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to the (0001) crystal plane. The n-type GaN crystal yields at least one X-ray anomalous transmission image having a square area of 10 mm×10 mm, preferably 15 mm×15 mm, and more preferably 20 mm×20 mm. In addition, the n-type GaN crystal has a Si concentration of 5×1016 atoms/cm3 or higher, O concentration of 3×1016 atoms/cm3 or lower, and/or a H concentration of 1×1017 atoms/cm3 or lower.
Claims20
An n-type GaN crystal, having two main surfaces facing opposite directions from each other, wherein
- one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane, and
- the n-type GaN crystal yields at least one X-ray anomalous transmission image having a square area of 10 mm×10 mm, and satisfies at least one condition of the following (a) to (c) regarding impurity concentrations:
- (a) a concentration of Si is 5×1016 atoms/cm3 or higher;
- (b) a concentration of 0 is 3×1016 atoms/cm3 or lower;
- and
- (c) a concentration of H is 1×1017 atoms/cm3 or lower.
Dependencies are inferred from the claim text.