Systems and methods for electrodeposition of tungsten disulfide coatings
AssigneeGM Global Technology Operations LLC
InventorsAdam Paul Rabe, Matthew G. Keast, Jacob Alexander Rabe, Zhe Li
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AssigneeGM Global Technology Operations LLC
InventorsAdam Paul Rabe, Matthew G. Keast, Jacob Alexander Rabe, Zhe Li
Estimating the term…
Systems, methods, and devices for electrodeposition of tungsten disulfide coatings are described. Electrodeposition of the coating includes coupling a power source to a surface of a substrate and to an electrode, immersing the surface of the substrate and the electrode into an aqueous solution, and forming a tungsten disulfide layer on the surface of the substrate. The surface is conductive, and the power source is a DC power source. The aqueous solution includes sodium metabisulfite, sodium tungstate, a surfactant, and a pH modifier. The tungsten disulfide layer is formed by applying, via the power source, a pulsed current to the surface of the substrate and the electrode in the aqueous solution and maintaining the pulsed current for a predetermined period of time.
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