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US 12,760,423 B2Granted
Method of forming an interconnect coating for an electrochemical device stack using laser sintering
AssigneeBloom Energy Corporation
InventorsAdam Byrd, Zigui Lu, Guoliang Xiao, Tad Armstrong, Harald Herchen, Travis Schmauss, Keji Pan
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Abstract
A method of forming a protective coating on an interconnect for an electrochemical device stack includes providing a powder on the interconnect and laser sintering the powder.
Claims21
A method of forming an electrochemical device stack, comprising:
- depositing a coating on an interconnect using a wet coating process, the coating comprising at least one metal or metal oxide powder and a plasticizer;
- drying the coating;
- laser sintering the dried coating to form a protective layer on the interconnect;
- and
- placing the interconnect between fuel cells or electrolyzer cells after forming the protective layer to form the electrochemical device stack,
- wherein the plasticizer is burned out during at least one of the drying or the laser sintering.
3 more elements
A method of forming an electrochemical device stack, comprising:
- depositing a coating on an interconnect using a wet coating process, the coating comprising at least one metal or metal oxide powder and a plasticizer;
- laser sintering the coating to burn out the plasticizer and to form a protective layer on the interconnect;
- and
- placing the interconnect between fuel cells or electrolyzer cells after forming the protective layer to form the electrochemical device stack.
1 more element
Dependencies are inferred from the claim text.