# US 12,760,210 B2 · Resin composition for adhesive layer, and multilayer tube

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- Number: US 12,760,210 B2
- Document ID: US12760210B2
- Status: Granted
- Kind: B2
- Application number: 18/695,046
- Filed: 2022-04-27
- Published: 2025-08-07
- Granted: 2026-10-13
- Earliest claimed: 2021-11-02
- Assignees: Toray Industries, Inc.; Polyplastics-Evonik Corporation
- Applicants: Polyplastics-Evonik Corporation; Toray Industries, Inc.
- Inventors: Takuya Ochiai; Yosuke Onoue; Rei Sato; Kazuya Okubo
- Web page: https://patentgrep.com/patent/US12760210B2

## CPC

- C09J 177/00: Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain (based on polyhydrazides C09J179/06; based on polyamide-imides C09J179/08); Adhesives based on derivatives of such polymers
- B29C 48/022: {characterised by the choice of material}
- B29C 48/09: Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels
- B29C 48/21: the layers being joined at their surfaces
- B29K 2023/08: {Copolymers of ethylene (B29K2023/16 takes precedence)}
- B29K 2033/04: Polymers of esters
- B29K 2077/00: Use of {PA, i.e.} polyamides, e.g. polyesteramides {or derivatives thereof}, as moulding material
- B29K 2081/04: {Polysulfides, e.g. PPS, i.e. polyphenylene sulfide or derivatives thereof}
- B29K 2105/0085: {Copolymers}
- B29K 2105/0088: {Blends of polymers}
- B29K 2105/0097: {Glues or adhesives, e.g. hot melts or thermofusible adhesives}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS

## Abstract

The present disclosure relates to a resin composition for an adhesive layer. The resin composition contains: a polyphenylene sulfide-based resin (A); a polyamide resin (B); a first thermoplastic resin (C) containing at least one type of functional group selected from the group consisting of an epoxy group, an acid anhydride group, a carboxyl group, a carboxylic acid salt, and a carboxylic acid ester; and a second thermoplastic resin (D) that is free of epoxy groups, acid anhydride groups, carboxyl groups, carboxylic acid salts, and carboxylic acid esters. The resin composition contains, with respect to 100 parts by weight of the polyphenylene sulfide-based resin (A), from 80 to 300 parts by weight of the polyamide resin (B), from 20 to 200 parts by weight of the first thermoplastic resin (C), and from 10 to 100 parts by weight of the second thermoplastic resin (D), and a terminal amino group concentration of the polyamide resin (B) is from 48 to 120 mmol/kg.

## Claims

### Claim 1

A resin composition for an adhesive layer, the resin composition comprising:
a polyphenylene sulfide-based resin (A);
a polyamide resin (B);
a first thermoplastic resin (C) containing at least one type of functional group selected from the group consisting of an epoxy group, an acid anhydride group, a carboxyl group, a carboxylic acid salt, and a carboxylic acid ester; and
a second thermoplastic resin (D) that is free of epoxy groups, acid anhydride groups, carboxyl groups, carboxylic acid salts, and carboxylic acid esters,
wherein
the resin composition contains, with respect to 100 parts by weight of the polyphenylene sulfide-based resin (A), from 80 to 300 parts by weight of the polyamide resin (B), from 20 to 200 parts by weight of the first thermoplastic resin (C), and from 10 to 100 parts by weight of the second thermoplastic resin (D), and
a terminal amino group concentration of the polyamide resin (B) is from 48 to 120 mmol/kg.

### Claim 2 (depends on 1)

The resin composition for an adhesive layer according to claim 1, wherein a melt mass-flow rate at 230° C. of the polyamide resin (B) is from 1 to 50 g/10 min.

### Claim 3 (depends on 1)

The resin composition for an adhesive layer according to claim 1, wherein the polyamide resin (B) contains at least one of polyamide 11 or polyamide 12.

### Claim 4 (depends on 1)

The resin composition for an adhesive layer according to claim 1, wherein
the resin composition has a matrix-domain structure including matrix and a domain,
the polyamide resin (B) is contained in the matrix, and
the polyphenylene sulfide-based resin (A) is contained in the domain.

### Claim 5 (depends on 1)

A multilayer tube in which three or more layers are layered, the multilayer tube comprising:
a first layer containing a polyamide resin;
a second layer arranged in an inner periphery side of the multilayer tube with respect to the first layer and containing a polyphenylene sulfide-based resin; and
an adhesive layer arranged in between the first layer and the second layer and bonding the first layer and the second layer,
wherein the adhesive layer is made of the resin composition for an adhesive layer according to claim 1.

### Claim 6 (depends on 5)

The multilayer tube according to claim 5, wherein the polyamide resin in the first layer contains at least one of polyamide 11 or polyamide 12.

### Claim 7 (depends on 5)

The multilayer tube according to claim 5, wherein the second layer further contains an epoxy-modified thermoplastic resin, and the second layer contains, with respect to 100 parts by weight of the polyphenylene sulfide-based resin, from 1 to 50 parts by weight of the epoxy-modified thermoplastic resin.