Compositions containing thermally conductive fillers

A composition, comprising:

• a molecule comprising an electrophilic functional group comprising an epoxide functional group and/or an isocyanate functional group and present in an amount of 1% by volume to 90% by volume based on total volume of the composition;
• a second molecule comprising a nucleophilic functional group comprising a thiol functional group, an amine functional group, and/or a hydroxyl functional group and present in an amount of 0.1% by volume to 89% by volume based on total volume of the composition;
• and
• a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles comprising a thermal conductivity of at least 5 W/m·K measured according to ASTM D7984 and a volume resistivity of at least 1 Ω·m measured according to ASTM D257,
• wherein the composition comprises the thermally conductive, electrically insulative filler particles in an amount of at least 50% by volume based on total volume of the filler package, and
• wherein the thermally conductive, electrically insulative filler particles comprise thermally stable filler particles.