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US 12,760,143 B2Granted
Resin composition for molding and electronic component device
AssigneeResonac Corporation
InventorsYuta Sukegawa, Arisa Yamauchi, Mika Tanaka, Tomoki Hirai, Yuji Noguchi, Yusuke Kondo, Michitoshi Arata, Masashi Yamaura, Ayumi Nakayama
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Abstract
A resin composition for molding and an electronic component device are provided. The resin composition for molding includes: a curable resin; and an inorganic filler including a calcium titanate particle.
Claims18
A resin composition for molding comprising:
- a curable resin;
- an inorganic filler containing calcium titanate particles;
- and
- a curing agent including a phenol curing agent and an active ester compound.
1 more element
Dependencies are inferred from the claim text.