Encapsulation resin
AssigneeDaikin Industries, Ltd.
InventorsYoshito Tanaka, Makoto Matsuura, Yuuki Suzuki, Akitoshi Ogata, Yosuke Kishikawa
Life of this patent
Estimating the term…
Abstract
An object of the present disclosure is to provide an encapsulation resin in which the occurrence of cracks is suppressed when the resin is used for encapsulation of ultraviolet light-emitting elements. Another object of the present disclosure is to provide an encapsulation resin composition for supplying the encapsulation resin. The present disclosure relates to an encapsulation resin for light-emitting elements, comprising a fluoropolymer, wherein the fluoropolymer comprises, as a main component, a monomer unit represented by formula (1): wherein R1 to R4 are each independently a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group.
Claims11
An encapsulation resin for light-emitting elements, comprising a fluoropolymer,
- wherein
- the fluoropolymer comprises a monomer unit represented by formula (1-1)
- wherein R1 is a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group,
- wherein the percentage of the monomer unit is 70 mol % or more based on the total monomer units in the fluoropolymer,
- wherein the fluoropolymer has a glass transition temperature of 110° C. or higher, and
- wherein the fluoropolymer has an indentation hardness of 250 N/mm2 or more and 100 N/mm2 or less.
Dependencies are inferred from the claim text.