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US 12,759,929 B2Granted
Electroless plating
AssigneeYield Engineering Systems, Inc.
InventorsRajeev Bajaj, Christopher Lane, Deepak Pandey, Purnima Narayanan
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Abstract
An apparatus comprising: a tank configured to hold an electroless plating solution and a substrate on which electroless plating is to be performed, the substrate immersed in the electroless plating solution; one or more transducers arranged to transmit vibrations to the substrate; and a driver configured to provide a drive signal to the one or more transducers, wherein the drive signal is configured to cause the one or more transducers to vibrate the substrate at a resonance frequency of the substrate.
Claims19
A method, comprising:
- immersing a substrate in an electroless plating solution in a tank, wherein the substrate comprises a glass panel having a lateral dimension of at least 50 cm;
- vibrating the substrate at a resonance frequency of the substrate, wherein the resonance frequency is in a range from 200 Hz to 500 Hz;
- and
- during vibration of the substrate, depositing a material on the substrate using the electroless plating solution.
1 more element
Dependencies are inferred from the claim text.